參數(shù)資料
型號(hào): MC8640DHX1250HE
廠商: Freescale Semiconductor
文件頁數(shù): 117/130頁
文件大?。?/td> 0K
描述: IC DUAL CORE PROCESSOR 1023-CBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.25GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 1023-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 1023-FCCBGA(33x33)
包裝: 托盤
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
87
Package
Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
dB/decade roll-off below this. The required sinusoidal jitter specified in Section 15.7, “Receiver
Specifications,is then added to the signal and the test load is replaced by the receiver being tested.
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8640
The package parameters are as provided in the following list. The package type is 33 mm
× 33 mm, 1023
pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
(FC-CBGA).
For all package types:
Die size
12.1 mm
× 14.7 mm
Package outline
33 mm
× 33 mm
Interconnects
1023
Pitch
1 mm
Total Capacitor count
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
2.97 mm
Minimum module height
2.47 mm
Solder Balls
89.5% Pb 10.5% Sn
Ball diameter (typical2)
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
2.77 mm
Minimum module height
2.27 mm
Solder Balls
95.5% Sn 4.0% Ag 0.5% Cu
Ball diameter (typical2)
0.60 mm
1 High-coefficient of thermal expansion
2 Typical ball diameter is before reflow
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