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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | MC33889DEG |
| 寤犲晢锛� | Freescale Semiconductor |
| 鏂囦欢闋佹暩(sh霉)锛� | 51/59闋� |
| 鏂囦欢澶у皬锛� | 0K |
| 鎻忚堪锛� | IC SYSTEM BASE W/CAN 28-SOIC |
| 妯欐簴鍖呰锛� | 24 |
| 鎺у埗鍣ㄩ鍨嬶細 | 绯荤当(t菕ng)鍩虹(ch菙)鑺墖 |
| 鎺ュ彛锛� | CAN |
| 闆绘簮闆诲锛� | 5.5 V ~ 18 V |
| 闆绘祦 - 闆绘簮锛� | 45mA |
| 宸ヤ綔婧害锛� | -40°C ~ 125°C |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 灏佽/澶栨锛� | 28-SOIC锛�0.295"锛�7.50mm 瀵級 |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 28-SOIC W |
| 鍖呰锛� | 绠′欢 |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
55
33889
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33889 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33889 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (TJ), and thermal resistance
(RJA).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Figure 25. Surface Mount for SOIC Wide Body
Non-Exposed Pad
28-PIN
SOICW
EG SUFFIX (PB-FREE)
98ASB42345
28-PIN SOICW
NOTE FOR PACKAGE DIMENSIONS,
REFER TO THE 33889 DEVICE DATASHEET.
33889EG
TJ
=
RJA
.
P
Table 31. Thermal Performance Comparison
Thermal Resistance
[
C/W]
JA (1) (2)
42
JB (2) (3)
11
JA (1) (4)
69
23
Notes
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
20 Terminal SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
鐩搁棞(gu膩n)PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| VE-22V-IX-S | CONVERTER MOD DC/DC 5.8V 75W |
| V72A12C400B3 | CONVERTER MOD DC/DC 12V 400W |
| VI-23B-IX-S | CONVERTER MOD DC/DC 95V 75W |
| V48C5M75BL3 | CONVERTER MOD DC/DC 5V 75W |
| V48C5M75BG2 | CONVERTER MOD DC/DC 5V 75W |
鐩搁棞(gu膩n)浠ｇ悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| MC33889DPEG | 鍔熻兘鎻忚堪:CAN 鎺ュ彛闆嗘垚闆昏矾 SBC-LITE-LS-CAN RoHS:鍚� 鍒堕€犲晢:Texas Instruments 椤炲瀷:Transceivers 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦: 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 灏佽 / 绠遍珨:SOIC-8 灏佽:Tube |
| MC33889DPEGR2 | 鍔熻兘鎻忚堪:CAN 鎺ュ彛闆嗘垚闆昏矾 SBC-LITE-LS-CAN RoHS:鍚� 鍒堕€犲晢:Texas Instruments 椤炲瀷:Transceivers 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦: 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 灏佽 / 绠遍珨:SOIC-8 灏佽:Tube |
| MC33889DW | 鍔熻兘鎻忚堪:IC SYSTEM BASE W/CAN 28-SOIC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 鎺у埗鍣� 绯诲垪:- 妯欐簴鍖呰:4,900 绯诲垪:- 鎺у埗鍣ㄩ鍨�:USB 2.0 鎺у埗鍣� 鎺ュ彛:涓茶 闆绘簮闆诲:3 V ~ 3.6 V 闆绘祦 - 闆绘簮:135mA 宸ヤ綔婧害:0°C ~ 70°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:36-VFQFN 瑁搁湶鐒婄洡 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:36-QFN锛�6x6锛� 鍖呰:* 鍏跺畠鍚嶇ū:Q6396337A |
| MC33889DWR2 | 鍔熻兘鎻忚堪:IC SYSTEM BASE W/CAN 28-SOIC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 鎺у埗鍣� 绯诲垪:- 妯欐簴鍖呰:4,900 绯诲垪:- 鎺у埗鍣ㄩ鍨�:USB 2.0 鎺у埗鍣� 鎺ュ彛:涓茶 闆绘簮闆诲:3 V ~ 3.6 V 闆绘祦 - 闆绘簮:135mA 宸ヤ綔婧害:0°C ~ 70°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:36-VFQFN 瑁搁湶鐒婄洡 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:36-QFN锛�6x6锛� 鍖呰:* 鍏跺畠鍚嶇ū:Q6396337A |
| MC33895FC | 鍔熻兘鎻忚堪:IC H-BRIDGE QUAD W/LIN 32-QFN RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 椹�(q奴)鍕曞櫒锛屾帴鏀跺櫒锛屾敹鐧�(f膩)鍣� 绯诲垪:- 妯欐簴鍖呰:1,000 绯诲垪:- 椤炲瀷:鏀剁櫦(f膩)鍣� 椹�(q奴)鍕曞櫒/鎺ユ敹鍣ㄦ暩(sh霉):2/2 瑕�(gu墨)绋�:RS232 闆绘簮闆诲:3 V ~ 5.5 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:16-SOIC锛�0.295"锛�7.50mm 瀵級 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:16-SOIC 鍖呰:甯跺嵎 (TR) |
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