參數(shù)資料
型號(hào)： M38B79FFFP
廠商： Mitsubishi Electric Corporation
英文描述： SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
中文描述： 單芯片8位CMOS微機(jī)
文件頁(yè)數(shù)： 108/109頁(yè)
文件大?。?/td> 1559K
代理商： M38B79FFFP
38B7 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
MITSUBISHI MICROCOMPUTERS
PRELIMINARY
Notice: This is not a final specification.
change.
Some parametric limits are subject to
2000 MITSUBISHI ELECTRIC CORP.
New publication, effective Apr. 2000.
Specifications subject to change without notice.
Notes regarding these materials
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer
’
s application; they do not convey any license under any intellectual property
rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party
’
s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples
contained in these materials.
Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product listed herein.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com).
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision
on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric
Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved
destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable
material or (iii) prevention against any malfunction or mishap.
HEAD OFFICE: 2-2-3, MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN
PACKAGE OUTLINE
QFP100-P-1420-0.65
1.58
Weight(g)
–
JEDEC Code
EIAJ Package Code
Lead Material
Alloy 42
100P6S-A
Plastic 100pin 14
20mm body QFP
–
0.1
2.8
–
–
–
0.2
–
–
–
–
–
–
–
–
–
–
–
–
–
0
°
Symbol
Min
Nom
Max
3.05
A
A
1
A
2
b
c
D
E
e
H
E
L
L
1
x
y
b
2
I
2
M
D
M
E
Dimension in Millimeters
H
D
0.35
–
14.6
20.6
1.3
–
–
10
°
0.1
1.4
–
0.8
0.6
0.4
23.1
22.8
22.5
17.1
16.8
16.5
0.65
20.2
20.0
19.8
14.2
14.0
13.8
0.2
0.15
0.13
0.4
0.3
0.25
0
e
e
E
c
H
E
1
30
31
81
50
80
51
H
D
D
M
D
M
E
A
F
A
1
A
2
L
1
L
y
b
2
I
2
Recommended Mount Pad
Detail F
100
0.13
b
x
M
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