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參數(shù)資料
| 型號： | M30828MH-XXXGP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, MROM, 30 MHz, MICROCONTROLLER, PQFP144 |
| 封裝： | 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 |
| 文件頁數(shù)： | 37/48頁 |
| 文件大?。?/td> | 847K |
| 代理商： | M30828MH-XXXGP |
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2.7.2 Thermal Management
The ADC08D1520 is capable of impressive speeds and per-
formance at very low power levels for its speed. However, the
power consumption is still high enough to require attention to
thermal management. For reliability reasons, the die temper-
ature should be kept to a maximum of 150°C. That is, T
A
(ambient temperature) plus ADC power consumption times
θ
JA (junction to ambient thermal resistance) should not ex-
ceed 150°C.
Please note that the following are recommendations for
mounting this device onto a PCB. This should be considered
the starting point in PCB and assembly process development.
It is recommended that the process be developed based upon
past experience in package mounting.
The bottom of the package of the ADC08D1520 provides the
primary heat removal path as well as excellent electrical
grounding to the printed circuit board. The land pattern design
for lead attachment to the PCB should be the same as for a
conventional LQFP, but the bottom of the package must be
attached to the board to remove the maximum amount of heat
from the package, as well as to ensure best product para-
metric performance.
To maximize the removal of heat from the package, a thermal
land pattern must be incorporated on the PC board within the
footprint of the package. The bottom of the device must be
soldered down to ensure adequate heat conduction out of the
package. The land pattern for this exposed pad should be as
large as the 600 x 600 mil bottom of the package and be lo-
cated such that the bottom of the device is entirely over that
thermal land pattern. This thermal land pattern should be
electrically connected to ground.
30024721
FIGURE 16. Recommended Package Land Pattern
Since a large aperture opening may result in poor release, the
aperture opening should be subdivided into an array of small-
er openings, similar to the land pattern of Figure 16.
To minimize junction temperature, it is recommended that a
simple heat sink be built into the PCB. This is done by includ-
ing a copper area of about 2.25 square inches (14.52 square
cm) on the opposite side of the PCB. This copper area may
be plated or solder coated to prevent corrosion, but should
not have a conformal coating, which could provide some ther-
mal insulation. Thermal vias should be used to connect these
top and bottom copper areas. These thermal vias act as "heat
pipes" to carry the thermal energy from the device side of the
board to the opposite side of the board where it can be more
effectively dissipated. The use of approximately 100 thermal
vias is recommended. Use of a higher weight copper on the
internal ground plane is recommended, (i.e. 2
OZ instead of
1
OZ, for thermal considerations only.
The thermal vias should be placed on a 61mil grid spacing
and have a diameter of 15 mil typically. These vias should be
barrel plated to avoid solder wicking into the vias during the
soldering process as this wicking could cause voids in the
solder between the package exposed pad and the thermal
land on the PCB. Such voids could increase the thermal re-
sistance between the device and the thermal land on the
board, which would cause the device to run hotter.
If it is desired to monitor die temperature, a temperature sen-
sor may be mounted on the heat sink area of the board near
the thermal vias. Allow for a thermal gradient between the
temperature sensor and the ADC08D1520 die of
θ
J-PAD times
typical power consumption.
2.7.3 TEMPERATURE SENSOR DIODE
The ADC08D1520 has an on-die temperature diode connect-
ed to pins Tdiode+/- which may be used to monitor the die
temperature. National also provides a family of temperature
sensors for this application which monitor different numbers
of external devices, See Table 9
TABLE 9. Temperature Sensor Recommendation
Number of External
Devices Monitored
Recommended Temperature
Sensor
1
LM95235
2
LM95213
4
LM95214
The LM95235/13/14 is an 11-bit digital temperature sensor
with a 2-wire System Management Bus (SMBus) interface
that can monitor the temperature of one/two/four remote
diodes as well as its own temperature. The LM95235/13/14
can be used to accurately monitor the temperature of up to
one/two/four external devices such as the ADC08D1520, a
FPGA, other system components, and the ambient tempera-
ture.
The LM95235/13/14 reports temperature in two different for-
mats for +127.875°C range and 0°/255°C range. The
LM95235/13/14 has a Sigma-Delta ADC core which provides
the first level of noise immunity. For improved performance in
a noise environment, the LM9535/13/14 includes pro-
grammable digital filters for Remote Diode temperature read-
ings. When the digital filters are invoked, the resolution for the
Remote Diode readings increases to 0.03125°C. For maxi-
mum flexibility and best accuracy, the LM95235/13/14 in-
cludes offset registers that allow calibration of other diode
types.
Diode fault detection circuitry in the LM95235/13/14 can de-
tect the absence or fault state of a remote diode: whether D+
is shorted to the power supply, D- or ground, or floating.
In the following typical application, the LM95213 is used to
monitor the temperature of an ADC08D1520 as well as a FP-
GA. See Figure 17
www.national.com
42
ADC08D1520QML
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