參數(shù)資料
型號(hào): M25P40
廠商: 意法半導(dǎo)體
元件分類: DRAM
英文描述: 4 Mbit Uniform Sector, Serial Flash Memory
中文描述: 4兆位統(tǒng)一部門,串行閃存
文件頁數(shù): 49/51頁
文件大?。?/td> 398K
代理商: M25P40
M25P40
Revision history
49/51
13
Revision history
Table 24.
Document Revision History
Date
Revision
Changes
12-Apr-2001
1.0
Document written
25-May-2001
1.1
Serial Paged Flash Memory renamed as Serial Flash Memory
11-Sep-2001
1.2
Changes to text: Signal Description/Chip Select; Hold Condition/1st para;
Protection modes; Release from Power-down and Read Electronic
Signature (RES); Power-up
Repositioning of several tables and illustrations without changing their
contents
Power-up timing illustration; SO8W package removed
Changes to tables: Abs Max Ratings/V
IO
; DC Characteristics/V
IL
16-Jan-2002
1.3
FAST_READ instruction added. Document revised with new timings, V
WI
,
I
CC3
and clock slew rate. Descriptions of Polling, Hold Condition, Page
Programming, Release for Deep Power-down made more precise. Value
of t
W
(max) modified.
12-Sep-2002
1.4
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-
out sequence.
VFQFPN8 package (MLP8) added. Document promoted to Preliminary
Data.
13-Dec-2002
1.5
Typical Page Program time improved. Deep Power-down current
changed. Write Protect setup and hold times specified, for applications
that switch Write Protect to exit the Hardware Protection mode
immediately before a WRSR, and to enter the Hardware Protection mode
again immediately after.
12-Jun-2003
1.6
Document promoted from Preliminary Data to full Datasheet
24-Nov-2003
2.0
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
40MHz AC Characteristics table included as well as 25MHz. I
CC3
(max),
t
SE
(typ) and t
BE
(typ) values improved. Change of naming for VDFPN8
package
12-Mar-2004
3.0
Automotive range added. Soldering temperature information clarified for
RoHS compliant devices
05-Aug-2004
4.0
Device Grade information clarified. Data-retention measurement
temperature corrected. Details of how to find the date of marking added.
03-Jan-2005
5.0
Small text changes. Notes 2 and 3 removed from
Table 23: Ordering
Information Scheme
.
End timing line of t
SHQZ
modified in
Figure 25: Output Timing
.
01-Aug-2005
6.0
Updated Page Program (PP) instructions in
Page Programming
,
Page
Program (PP)
,
Instruction Times (Device Grade 6)
and
Instruction Times
(Device Grade 3)
.
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