參數(shù)資料
型號: LTC2184IUP#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
封裝: 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64
文件頁數(shù): 29/36頁
文件大小: 799K
代理商: LTC2184IUP#TRPBF
35
218543f
LTC2185/LTC2184/LTC2183
package DescripTion
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
9 .00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40
± 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15
± 0.10
7.15
± 0.10
7.50 REF
(4-SIDES)
0.75
± 0.05
R = 0.10
TYP
R = 0.115
TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±0.05
7.50 REF
(4 SIDES)
7.15
±0.05
7.15
±0.05
8.10
±0.05 9.50 ±0.05
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
UP Package
64-Lead Plastic QFN (9mm
× 9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
相關(guān)PDF資料
PDF描述
LTC2183CUP#TRPBF 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2184IUP#PBF 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2185IUP#PBF 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2183IUP#PBF 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
LTC2184CUP#TRPBF 2-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
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