參數(shù)資料
型號： LAN8187_06
廠商： SMSC Corporation
英文描述： 【15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWRTM
中文描述： 【15kV的ESD保護(hù)信息產(chǎn)業(yè)部/ RMII快速以太網(wǎng)PHY與HP Auto - MDIX功能和SMSC flexPWRTM
文件頁數(shù)： 64/72頁
文件大?。?/td> 433K
代理商： LAN8187_06
±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
TM
Datasheet
Revision 1.0 (12-14-06)
64
SMSC LAN8187/LAN8187I
DATASHEET
7.1.1.2
IEC61000-4-2 Performance
The IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity
to ESD strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed
at the device level with the device powered down.
In addition to defining the ESD tests, IEC 61000-4-2 also categorizes the impact to equipment
operation when the strike occurs (ESD Result Classification). The LAN8187 maintains an ESD Result
Classification 1 or 2 when subjected to an IEC 61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applying stress conditions are defined by
the IEC61000-4-2 ESD document.
AIR DISCHARGE
To perform this test, a charged electrode is moved close to the system being tested until a spark is
generated. All pins of the LAN8187 can safely dissipate +/- 15kV air discharges per the IEC61000-4-
2 specification without additional board level protection. This test is difficult to reproduce because the
discharge is influenced by such factors as humidity, the speed of approach of the electrode, and
construction of the test equipment.
CONTACT DISCHARGE
The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized.
This yields more repeatable results, and is the preferred test method. All pins of the LAN8187 can
safely dissipate +/- 8kV contact discharges per the IEC61000-4-2 specification without the need for
additional board level protection.
7.1.2
Operating Conditions
7.1.3
Power Consumption
7.1.3.1
Power Consumption Device Only
Power measurements taken over the operating conditions specified. See
Section 5.4.5
for a description
of the power down modes
Table 7.3 Recommended Operating Conditions
Parameter
Conditions
MIN
TYP
MA
X
UNIT
S
Comment
VDD33
VDD33 to VSS
3.0
3.3
3.6
V
INPUT VOLTAGE ON
DIGITAL PINS
0.0
VDD
IO
V
VOLTAGE ON ANALOG
I/O PINS (RXP, RXN)
0.0
+3.6
V
V
AMBIENT TEMPERATURE
T
A
LAN8187-JT
0
70
C
For Commercial
Temperature
T
LAN8187I-
AEZG
-40
+85
C
For Industrial Temperature
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