參數(shù)資料
型號(hào): ISP1583ET2
廠商: NXP SEMICONDUCTORS
元件分類: 總線控制器
英文描述: UNIVERSAL SERIAL BUS CONTROLLER, PBGA64
封裝: 6 X 6 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC, MO-195, SOT543-1,TFBGA-64
文件頁(yè)數(shù): 5/100頁(yè)
文件大?。?/td> 508K
代理商: ISP1583ET2
ISP1583_7
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 22 September 2008
11 of 99
NXP Semiconductors
ISP1583
Hi-Speed USB peripheral controller
[1]
Symbol names ending with underscore N, for example, NAME_N, represent active LOW signals.
[2]
All outputs and I/O pins can source 4 mA, unless otherwise specied.
[3]
Control signals are not 3-stated.
[4]
Add a decoupling capacitor (0.1
F) to all the supply pins. For better EMI results, add a 0.01 F capacitor in parallel to 0.1 F.
[5]
The DMA bus is in 3-state until a DMA command (see Section 9.4.1) is executed.
BUS_
CONF/
DA0[3]
62
B2
A3
I/O
Bus conguration input — Selects bus mode during
power-up:
LOW: split bus mode; multiplexed 8-bit address and
data bus on AD[7:0], separate DMA data bus
DATA[15:0][5]
HIGH (connect to VCC(I/O)): generic processor mode;
separate 8-bit address on AD[7:0], 16-bit processor
data bus on DATA[15:0]; DMA is multiplexed on
processor bus DATA[15:0]
Address selection output — Selects the Task File
register of an ATA/ATAPI device at normal operation; see
bidirectional pad; 10 ns slew-rate control; TTL; 5 V tolerant
WAKEUP
63
A2
B2
I
wake-up input; when this pin is at the HIGH level, the chip
is prevented from going into the suspend state and
wake-up the chip when already in suspend mode; when
not in use, connect this pin to ground through a 10 k
resistor
When the RESET_N pin is LOW, ensure that the WAKEUP
pin does not go from LOW to HIGH; otherwise the device
will enter test mode.
input pad; TTL; 5 V tolerant
SUSPEND 64
C2
A2
O
suspend state indicator output; used as a power switch
control output to power-off or power-on external devices
when going into suspend mode or recovering from
suspend mode
CMOS output; 8 mA drive
DGND
-
B9
-
digital ground
DGND
exposed die
pad
J9
B8, G7
-
ground supply; down bonded to the exposed die pad (heat
sink); to be connected to DGND during the PCB layout
Table 3.
Pin description …continued
Symbol[1]
Pin
Type[2] Description
ISP1583BS ISP1583ET;
ISP1583ET2
ISP1583ET1
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