30 FN7575.5 September 5, 2012 Products Intersil Corporation is a leader in the design and manufacture of high-performance analog sem" />
參數(shù)資料
型號: ISL12022MAIBZ
廠商: Intersil
文件頁數(shù): 24/31頁
文件大?。?/td> 0K
描述: IC RTC/CALENDAR TEMP SNSR 20SOIC
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 38
類型: 時鐘/日歷
特點: 警報器,夏令時,閏年,SRAM
存儲容量: 128B
時間格式: HH:MM:SS(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 5.5 V
電壓 - 電源,電池: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC
包裝: 管件
ISL12022MA
30
FN7575.5
September 5, 2012
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL12022MA
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
August 22, 2012 FN7575.5 Corrected Pin 4 in “TYPICAL APPLICATION CIRCUIT” on page 1 from "GND" to "NC" to match “Pin Configuration” and “Pin
August 7, 2012
FN7575.4 Changed Pin 1 from GNC to GND on page 2.
Removed bullet left column above Figure 22 on page 28 which read: "Be sure to ground pins 6 and 15 as well as pin 8
as these all insure the integrity of the device ground".
May 16, 2012
FN7575.3 Added new section header “OSCILLATOR ACCURACY” on page 7
Removed Min/Max of -5/5ppm for “Oscillator Stability vs Temperature” on page 7. Added typ of ±2ppm
Changed Min/Max for “Oscillator Initial Accuracy” on page 7 from -3/+3 ppm to -2/+8ppm
Added notes 17, 18 cross references where required to above specs.
Added notes 17, 18 and 19 to end of spec table on page 8.
“Layout Considerations” on page 27. Changed 1st sentence of 2nd paragraph from:
"The part of the package that has NC pins from pin 4 to 6 and from pin 15 to 17 contains the crystal." to "The part of the
package from pin 4 to 6 and from pin 15 to 17 contains the crystal."
October 24, 2011 FN7575.2 On page 1, 1st paragraph, added “Backup battery current draw is less than 1.6A over the temperature range.”
Under Features, added bullet “1.6A Max Battery Current”
On page 6, DC Operating Characteristics: for IDD1 at 5V and 3V limits, changed MAX from 7A and 6A to 15A and
14A.
On page 7, Power-Down Timing: added VDDSR+ with TYP value of 0.05V/ms, with reference to Note 16.
On page 8, added Note 16 for VDDSR+
On page 13, Oscillator Compensation: text deleted: "These values can be overwritten by the user although this is not
suggested as the resulting temperature compensation performance will be compromised."
On page 16, Oscillator Fail Bit: changed text from "Oscillator Fail Bit indicates that the oscillator has stopped." to:
"Oscillator Fail Bit indicates that the oscillator has failed. The oscillator frequency is either zero or very far from the
desired 32.768kHz due to failure, PC board contamination or mechanical issues."
On page 16, Daylight Saving Time Change Bit (DSTADJ): removed "DSTADJ can be set to "1" for instances where the
RTC device is initialized during the DST Forward period." and added "It is read-only and cannot be written. Setting
time during a DST forward period will not set this bit to "1"."
On page 21, Table 20, FDTR column heading changed from <2:0> to <4:0>
On page 27, added “Power Supply Considerations” section.
On page 27, added paragraph at beginning of Layout Considerations for handling.
On page 31, Package Outline Drawing: replaced M20.3, Rev 2, 6/15, with M20.3, Rev 3, 2/11.
July 1, 2010
FN7575.1 In the “Device Handling Precautions” on page 29, changed the max reflow temperature from “+280°C” to “+260°C for
>30 sec”
June 1, 2010
FN7575.0 Initial Release.
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