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參數(shù)資料
| 型號： | IRF7106 |
| 廠商： | International Rectifier |
| 英文描述： | Power MOSFET(Vdss=+-20V) |
| 中文描述： | 功率MOSFET（減振鋼板基本\u003d - 20V的） |
| 文件頁數(shù)： | 1/7頁 |
| 文件大?。?/td> | 158K |
| 代理商： | IRF7106 |
N-Ch
P-Ch
V
DSS
20V
-20V
R
DS(on)
0.125
0.20
I
D
3.0A
-2.5A
IRF7106
HEXFET
Power MOSFET
PD - 9.1098B
Advanced Process Technology
Ultra Low On-Resistance
Dual N and P Channel Mosfet
Surface Mount
Available in Tape & Reel
Dynamic dv/dt Rating
Fast Switching
Description
Fourth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance per silicon
area. This benefit, combined with the fast switching speed and ruggedized device
design for which HEXFET Power MOSFETs are well known, provides the designer
with an extremely efficient device for use in a wide variety of applications.
The SO-8 has been modified through a customized leadframe for enhanced
thermal characteristics and multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple devices can be used in an
application with dramatically reduced board space. The package is designed for
vapor phase, infra-red, or wave soldering techniques. Power dissipation of greater
than 0.8W is possible in a typical PCB mount application.
D1
N-CHANNEL MOSFET
1
P-CHANNEL MOSFET
D1
D2
D2
G1
S2
G2
S1
Top View
8
2
3
4
5
6
7
PRELIMINARY
Absolute Maximum Ratings
Parameter
Units
Max.
N-Channel
3.0
2.5
10
P-Channel
-2.5
-2.0
-10
I
D
@ T
C
= 25°C
I
D
@ T
C
= 70°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
A
2.0
0.016
± 20
V
GS
dv/dt
T
J,
T
STG
V
3.0
-3.0
V/ns
°C
-55 to + 150
W
W/°C
SO-8
Thermal Resistance
Parameter
Min.
––––
Typ.
––––
Max.
62.5
Units
°C/W
R
θ
JA
Junction-to-Ambient (PCB Mount)**
** When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
Revision 3
69
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