參數(shù)資料
型號(hào)： IBM25PPC750L-GB375A2R
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 375 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 23/48頁(yè)
文件大小： 608K
代理商： IBM25PPC750L-GB375A2R
12/8/99
Version 1.02
Page 3
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Preface ..................................................................................................................................................... 4
New Features for dd3.x ............................................................................................................................ 4
Overview ................................................................................................................................................... 5
Features ................................................................................................................................................... 6
General Parameters ................................................................................................................................. 8
Electrical and Thermal Characteristics ..................................................................................................... 9
DC Electrical Characteristics ................................................................................................................ 9
AC Electrical Characteristics .................................................................................................................. 13
Clock AC Specifications ...................................................................................................................... 13
60x Bus Input AC Specifications ......................................................................................................... 14
60x Bus Output AC Specifications ...................................................................................................... 16
L2 Clock AC Specifications ................................................................................................................. 18
L2 Bus Input AC Specifications ........................................................................................................... 20
L2 Bus Output AC Specifications ........................................................................................................ 21
IEEE 1149.1 AC Timing Specifications .................................................................................................. 22
PowerPC 740 Microprocessor Pin Assignments .................................................................................... 24
PowerPC 740 Microprocessor Pinout Listings ....................................................................................... 25
PowerPC 740 Package .......................................................................................................................... 28
Mechanical Dimensions of the PowerPC 740 255 CBGA Package .................................................... 29
PowerPC 750 Microprocessor Pin Assignments .................................................................................... 30
PowerPC 750 Package .......................................................................................................................... 33
Mechanical Dimensions of the PowerPC 750 360 CBGA Package .................................................... 34
System Design Information .................................................................................................................... 36
PLL Configuration ............................................................................................................................... 36
PLL Power Supply Filtering ................................................................................................................. 37
Decoupling Recommendations ........................................................................................................... 37
Connection Recommendations ........................................................................................................... 37
Output Buffer DC Impedance .............................................................................................................. 38
Pull-up Resistor Requirements ........................................................................................................... 39
Thermal Management Information ...................................................................................................... 40
Internal Package Conduction Resistance ........................................................................................... 41
Heat Sink Selection Example .............................................................................................................. 44
Ordering Information ............................................................................................................................... 46
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