參數(shù)資料
型號: IBM25PPC750L-GB375A2R
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 375 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 22/48頁
文件大?。?/td> 608K
代理商: IBM25PPC750L-GB375A2R
12/8/99
Version 1.02
Page 29
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Mechanical Dimensions of the PowerPC 740 255 CBGA Package
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA
Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
DIM
MIN
MAX
MILLIMETERS
A
2.45
3.00
A1
0.80
1.00
A2
0.90
1.10
b
0.82
0.93
D
21.00 BSC
D1
5.443 BSC
e
1.27 BSC
E
21.00 BSC
E1
8.075 BSC
A
A1
A2
C
0.15 C
B
C
255X
e
123456789 10111213141516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e/2
A
0.3
C
0.15
b
e/2
0.2
D
2X
A1 CORNER
E
E1
D1
0.2
2X
B
A
There is no ball
A1 CORNER
Top View
X-ray view of balls
from top of package
in the A01 position
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