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參數資料
| 型號： | IBM25PPC750L-EB0C375W |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 375 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數： | 37/46頁 |
| 文件大?。?/td> | 610K |
| 代理商： | IBM25PPC750L-EB0C375W |
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Page 38
Version 2.0
Datasheet
9/30/99
PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon, Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067
AI Technology (e.g. EG7655)
609-882-2332
1425 Lower Ferry Road
Trent, NJ 08618
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.
T
J = TA + TR + (
θ
JC +
θ
INT +
θ
SA)
× P
D
Where:
T
J is the die-junction temperature
T
A is the inlet cabinet ambient temperature
T
R is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat sink-to-ambient thermal resistance
P
D is the power dissipated by the device
Typical die-junction temperatures (T
J) should be maintained less than the value specified in Table “Package
Thermal Characteristics,” on page 7. The temperature of the air cooling the component greatly depends upon
the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic cab-
inet inlet-air temperature (T
A) may range from 30 to 40
°C. The air temperature rise within a cabinet (T
R) may
be in the range of 5 to 10
°C. The thermal resistance of the interface material (θ
INT) is typically about 1
°C/W.
Assuming a T
A of 30
°C, a T
R of 5
°C, a CBGA package θ
JC = 0.03, and a power dissipation (PD) of 5.0 watts, the
following expression for T
J is obtained.
Die-junction temperature: T
J = 30
°C + 5°C + (0.03°C/W +1.0°C/W + θ
SA)
× 5W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA) versus air flow velocity
is shown in Figure 21.
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