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| 型號(hào)： | IBM25NPE405H-3BA266CZ |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA580 |
| 封裝： | 35 MM, PLASTIC, EBGA-580 |
| 文件頁(yè)數(shù)： | 49/74頁(yè) |
| 文件大?。?/td> | 1423K |
| 代理商： | IBM25NPE405H-3BA266CZ |
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Preliminary
PowerNP NPe405H Embedded Processor Data Sheet
53
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P
×θ
JC, where TJMax is maximum junction temperature and P is power consumption.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +2.7
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage 2
AVDD
0 to +2.7
V
Input Voltage (3.3 V LVTTL receivers)
VIN
-0.6 to (OVDD + 0.6)
V
Input Voltage (5.0 V LVTTL receivers)
VIN
-0.6 to (OVDD + 2.4)
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Notes:
1. All voltages are specified with respect to ground (GND).
2. AVDD should be derived from VDD using the following circuit:
Package Thermal Specifications
The NPe405H is designed to operate within a case temperature range of -40°C to 85°C. Thermal resistance values for
the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35mm, 580-balls—Junction-to-Case
θ
JC
222
°C/W
35mm, 580-balls—Case-to-Ambient1
θ
CA
13
12
11
°C/W
VDD
C1
C2
C3
AVDD
L1
L1 – 2.2
H SMT inductor (equivalent to MuRata
LQH3C2R2M34) or SMT chip ferrite bead (equivalent
to MuRata BLM31A700S)
C1 – 3.3
F SMT tantalum
C2 – 0.1
F SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
C3 – 0.01
F SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IBM25NPE405H-3DA200CZ | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA580 |
| IBM25NPE405L-3DA200CZ | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA324 |
| IBM25NPE405L-3FA200CZ | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA324 |
| IBM25NPE405L-3FA266CZ | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA324 |
| IBM25PPC405EP-3GB133CZ | 32-BIT, 133.33 MHz, RISC PROCESSOR, PBGA385 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25NPE405L-3FA133C | 制造商:AMCC 制造商全稱(chēng):Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25NPE405L-3FA133CZ | 制造商:AMCC 制造商全稱(chēng):Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25NPE405L-3FA200C | 制造商:AMCC 制造商全稱(chēng):Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25NPE405L-3FA200CZ | 制造商:AMCC 制造商全稱(chēng):Applied Micro Circuits Corporation 功能描述:PowerNP |
| IBM25NPE405L-3FA266C | 制造商:AMCC 制造商全稱(chēng):Applied Micro Circuits Corporation 功能描述:PowerNP |
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