Confidential
HV7131R
This document is a general product description and is subject to change without notice. MagnaChip
Semiconductor Ltd. does not assume any responsibility for use of circuits described and no patent
licenses are implied.
- 3 -
2004 MagnaChip Semiconductor Ltd.
CONTENTS
General Description
....................................................................................................................4
Features
........................................................................................................................................4
Block Diagram
.............................................................................................................................5
Pin Diagram
..................................................................................................................................6
Pixel Array Structure
...............................................................................................................7
Pin Description
............................................................................................................................8
Functional Description
...............................................................................................................9
Register Description
................................................................................................................. 11
Frame Timing
.............................................................................................................................21
I2C Chip Interface
......................................................................................................................24
AC/DC Characteristics
..............................................................................................................26
MCLK Duty Cycle.........................................................................................................27
ENB Timing..................................................................................................................27
RESETB Timing...........................................................................................................27
Electro-Optical Characteristics
................................................................................................30
Electro-Optical Test Condition .............................................................................................30
Soldering..............................................................................................................................30
Package Specification
..............................................................................................................32
MEMO..................................................................................................................................33