參數(shù)資料
型號: HD64F2328
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù): 47/67頁
文件大?。?/td> 382K
代理商: HD64F2328
Rev. 2.0, 03/06/02, 42
3.3
Ordering Build Phases
In a standard build (shown in figure 3.5), you could add a phase at four different positions: before the compiler,
before the assembler, before the linker or after the linker. You may place your own custom phases or move
system phases to any position in the build order. It is important to remember that if the output of your custom
phase can be input into another phase then the phase order must be correct if the build is to behave as intended.
BEGIN
END
COMPILE
ASSEMBLE
LINK
1
2
3
4
Figure 3.5: Typical Build Process
The build phase dialog provides facilities for ordering build phases via the “Build Phases” dialog. It has two
tabs, which are concerned with the ordering of phases: “Build Order” and “Build File Order”.
相關(guān)PDF資料
PDF描述
HD64F2329 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2329B Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2329E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2338 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2339 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2328BVF25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2328BVF25W 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K I-TEMP 120-QFP - Trays
HD64F2328BVTE25 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K 120-TQFP - Trays
HD64F2328VF25 功能描述:IC H8S MCU FLASH 256K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB(384K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2328VF25I 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 128PQFP - Trays