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參數(shù)資料
| 型號(hào)： | HD64F2328 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機(jī)開(kāi)發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能 |
| 文件頁(yè)數(shù)： | 34/67頁(yè) |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2328 |
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problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the
information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest
product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s
sales office before using the product in an application that demands especially high quality and reliability or where its
failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics,
nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum
rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics.
Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the
guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ
systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury,
fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written
approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2329B | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329E | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F2338 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2339 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2328BVF25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2328BVF25W | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K I-TEMP 120-QFP - Trays |
| HD64F2328BVTE25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K 120-TQFP - Trays |
| HD64F2328VF25 | 功能描述:IC H8S MCU FLASH 256K 128-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD64F2328VF25I | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 128PQFP - Trays |
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