參數(shù)資料
型號(hào): HD64F2328
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù): 28/67頁(yè)
文件大?。?/td> 382K
代理商: HD64F2328
Rev. 2.0, 03/06/02, 25
Figure 2.17: Add Configuration Dialog
3. Enter the new configuration name into the “Configuration name” field. As you enter the new
configuration name, the directory underneath changes to reflect the configuration directory that will be
used. Select one of existing configurations, from which you want to copy a configuration, out of the drop-
down list of the “Based on configuration” field. Click “OK” on both dialogs to create the new
configuration.
To remove a configuration:
1. Select [Options->Build Configurations…] to display the “Build Configurations” dialog (figure 2.16).
2. Select the configuration that you want to remove and then click the “Remove” button.
3. Click “OK” to close the “Build Configurations” dialog.
相關(guān)PDF資料
PDF描述
HD64F2329 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2329B Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2329E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2338 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2339 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2328BVF25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2328BVF25W 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K I-TEMP 120-QFP - Trays
HD64F2328BVTE25 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K 120-TQFP - Trays
HD64F2328VF25 功能描述:IC H8S MCU FLASH 256K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設(shè)備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB(384K x 8) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2328VF25I 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 128PQFP - Trays