參數(shù)資料
型號(hào)： HD64F2328
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù)： 32/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2328
Rev. 2.0, 03/06/02, 29
2.7
File Dependencies
A typical project will contain dependencies between files, for example, one C file may “#include” one or more
header files. In complex projects, source files will include (or depend upon) others and this can quickly become
difficult to manage. However, the HEW provides a dependency scanning mechanism whereby all files in a
project are checked for dependencies. Once complete, the project window will display an up-to-date list with all
the project file dependencies.
To update a project’s dependencies:
Select [Build->Update All Dependencies] or click the right mouse button on a project icon in the “Projects”
tab of the “Workspace” window and select [Update All Dependencies] from the pop-up menu.
Initially, the dependencies for all files are contained within the “Dependencies” folder (figure 2.20.i).
2.8
Configuring the Workspace Window
If you click the right mouse button anywhere inside the “Projects” tab of the “Workspace” window, a pop-up
menu will be invoked. Select the “Configure View…” menu option to modify the way in which information is
displayed. The following four sections detail the effect of each option on the “Configure View” dialog.
2.8.1
Show Dependencies under Each File
If you select “Show dependencies under each file”, the dependent files are shown under the including source file
as a flat structure, i.e. the files themselves become folders (figure 2.20.ii). If this option is not selected then a
separate folder contains all dependencies (figure 2.20.i).
Figure 2.20: Dependencies under Each File
相關(guān)PDF資料
PDF描述
HD64F2329 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
HD64F2329B Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2329E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2338 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2339 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2328BVF25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2328BVF25W 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K I-TEMP 120-QFP - Trays
HD64F2328BVTE25 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K 120-TQFP - Trays
HD64F2328VF25 功能描述:IC H8S MCU FLASH 256K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2328VF25I 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 128PQFP - Trays
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*