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參數(shù)資料
| 型號(hào)： | HD64F2328 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能 |
| 文件頁(yè)數(shù)： | 43/67頁(yè) |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2328 |
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Rev. 2.0, 03/06/02, 39
The second step (figure 3.3b) asks what type of phase you would like to create. There are two choices: multiple
or single. When a multiple phase is executed, the command is applied to each file in the project of a certain file
group. For example, if you set the input file group to be C source files then the command will be executed once
for each C source file in the project. A single phase is executed once at most during a build.
Figure 3.3b: New Build Phase Dialog (Step 2)
The input file group list contains the current file groups defined for the project. It is possible to define multiple
input file groups by selecting the “Multiple Groups…” entry in the input file group list. Selecting this list entry
displays the dialog in figure 3.3c.
Figure 3.3c: Modify multiple input file groups
Once this choice has been made the input file group selection is displayed as “Multiple Groups…” This dialog
allows the user to choose multiple input file groups for the custom phase being added to the project. To select a
file group check the box next to the file groups name. One or more file groups can be selected in this dialog.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2329B | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329E | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F2338 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2339 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2328BVF25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2328BVF25W | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K I-TEMP 120-QFP - Trays |
| HD64F2328BVTE25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 256K 120-TQFP - Trays |
| HD64F2328VF25 | 功能描述:IC H8S MCU FLASH 256K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD64F2328VF25I | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 128PQFP - Trays |
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