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參數(shù)資料
| 型號(hào)： | HC6094 |
| 廠商： | Intersil Corporation |
| 英文描述： | DRAM Memory IC; Memory Type:NMOS DRAM; Access Time, Tacc:200ns; Package/Case:16-DIP; Memory Configuration:4K x 1; Mounting Type:Through Hole |
| 中文描述： | ADSL模擬前端芯片 |
| 文件頁(yè)數(shù)： | 9/9頁(yè) |
| 文件大小： | 51K |
| 代理商： | HC6094 |
9
Metric Plastic Quad Flatpack Packages (MQFP/PQFP)
D
D1
E E1
-A-
PIN 1
A2A1
A
5
o
-16
o
5
o
-16
o
0
o
-7
o
0.40
0
o
MIN
L
PLANE
B
0.005/0.009
0.13/0.23
WITH PLATING
BASE METAL
SEATING
0.005/0.007
0.13/0.17
B1
-B-
e
0.008
0.20
A-B
S
D
S
C
M
0.10
0.004
-C-
-D-
-H-
Q44.10x10
(JEDEC MO-108AA-2 ISSUE A)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
SYM-
BOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.093
-
2.35
-
A1
0.004
0.010
0.10
0.25
-
A2
0.077
0.083
1.95
2.10
-
B
0.012
0.018
0.30
0.45
6
B1
0.012
0.016
0.30
0.40
-
D
0.510
0.530
12.95
13.45
3
D1
0.390
0.398
9.90
10.10
4, 5
E
0.510
0.530
12.95
13.45
3
E1
0.390
0.398
9.90
10.10
4, 5
L
0.026
0.037
0.65
0.95
-
N
44
44
7
e
0.032 BSC
0.80 BSC
-
Rev. 1 1/94
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
4. Dimensions D1 and E1 to be determined at datum plane
.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
.
-C-
-H-
HC6094
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HC6094IN | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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