
5
Definitions
1. Supply currents/power dissipation measured in a quiescent (static) state with R
L
open.
2. Logic input levels and timing are verified by using them as conditions for testing DAC and filter.
3. Digital input currents are measured at 0V and V
CC
.
4. DAC resolution and monotonicity guaranteed by ILE and DLE tests.
5. DAC ILE is relative to best fit straight line.
6. Output drive current is the output current at 0V for each output when they are driven to
±
Full Scale.
7. Output offset measured with V
IN
= 0V differential for the R
X
, and the DAC at mid scale for the T
X
.
8. PSRR is the change in differential input voltage vs. change in supply voltage at DC.
9. T
X
Gain is calculated as 20*Log((TXout
DACFS
- TXout
DACZS
)/12V) at DC.
10. R
X
input swing is verified by using this as condition for gain testing.
11. R
X
Input Impedance is calculated as
V
IN
/
I
IN
where V
IN
is the maximum input voltages, with the PGA set to 0dB.
12. R
X
CMRR is calculated as 20*Log(V
OUT
/V
IN
)-PGA Gain. V
IN
is set to 250mV
PEAK
(CMIR) at 1.1MHz, and PGA gain is
set to maximum.
13. R
X
Gain is calculated as 20*Log(dV
OUT
/dV
IN
), where V
IN
is set to give a nominal
±
Output Swing, or the maximum input
swing, whichever is smaller. It is tested DC.
14. Filter Gain/Attenuation is relative to low frequency passband gain. T
X
tested by driving the DAC (with sinX/X correction),
R
X
tested by driving PGA2. Wafer probe will use special test points to bypass the DAC for laser trimming.
15. MTPR - (Multi-Tone Power Ratio). A DMT waveform is generated which has a specific crest factor or peak to average ratio
(PAR) with specific carriers missing. The waveform is then passed through the T
X
or R
X
chain. The total integrated power
of the notch at the location of the missing carriers is measured with respect to the adjacent carriers. Notch depth is mea-
sured for several DMT waveforms with different PARs. The notch depths for each DMT waveform are averaged to give an
MTPR number.
HC6094