參數(shù)資料
型號(hào): GS881E36CGD-250IT
廠商: GSI TECHNOLOGY
元件分類: SRAM
英文描述: 256K X 36 CACHE SRAM, 5.5 ns, PBGA165
封裝: 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
文件頁(yè)數(shù): 32/39頁(yè)
文件大小: 1302K
代理商: GS881E36CGD-250IT
GS881E18C(T/D)/GS881E32C(T/D)/GS881E36C(T/D)
Rev: 1.01 6/2010
38/39
2008, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
256K x 36
GS881E36CGD-333I
DCD Pipeline/Flow Through
RoHS-compliant 165 BGA
333/4.5
I
256K x 36
GS881E36CGD-300I
DCD Pipeline/Flow Through
RoHS-compliant 165 BGA
300/5
I
256K x 36
GS881E36CGD-250I
DCD Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
I
256K x 36
GS881E36CGD-200I
DCD Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
I
256K x 36
GS881E36CGD-150I
DCD Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
I
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18CT-150IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
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