參數(shù)資料
型號(hào)： GS81302T18E-350T
廠商： GSI TECHNOLOGY
元件分類： SRAM
英文描述： 8M X 18 DDR SRAM, 0.45 ns, PBGA165
封裝： 15 X 17 MM, 1 MM PITCH, FPBGA-165
文件頁數(shù)： 27/36頁
文件大?。?/td> 1243K
代理商： GS81302T18E-350T
GS81302T08/09/18/36E-375/350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.03 4/2011
33/36
2011, GSI Technology
Ordering Information—GSI SigmaDDR-II SRAM
Org
Part Number1
Type
Package
Speed (MHz)
TJ2
16M x 8
GS81302T08E-375
SigmaDDR-II B2 SRAM
165-bump BGA
375
C
16M x 8
GS81302T08E-350
SigmaDDR-II B2 SRAM
165-bump BGA
350
C
16M x 8
GS81302T08E-333
SigmaDDR-II B2 SRAM
165-bump BGA
333
C
16M x 8
GS81302T08E-300
SigmaDDR-II B2 SRAM
165-bump BGA
300
C
16M x 8
GS81302T08E-250
SigmaDDR-II B2 SRAM
165-bump BGA
250
C
16M x 8
GS81302T08E-375I
SigmaDDR-II B2 SRAM
165-bump BGA
375
I
16M x 8
GS81302T08E-350I
SigmaDDR-II B2 SRAM
165-bump BGA
350
I
16M x 8
GS81302T08E-333I
SigmaDDR-II B2 SRAM
165-bump BGA
333
I
16M x 8
GS81302T08E-300I
SigmaDDR-II B2 SRAM
165-bump BGA
300
I
16M x 8
GS81302T08E-250I
SigmaDDR-II B2 SRAM
165-bump BGA
250
I
16M x 9
GS81302T09E-375
SigmaDDR-II B2 SRAM
165-bump BGA
375
C
16M x 9
GS81302T09E-350
SigmaDDR-II B2 SRAM
165-bump BGA
350
C
16M x 9
GS81302T09E-333
SigmaDDR-II B2 SRAM
165-bump BGA
333
C
16M x 9
GS81302T09E-300
SigmaDDR-II B2 SRAM
165-bump BGA
300
C
16M x 9
GS81302T09E-250
SigmaDDR-II B2 SRAM
165-bump BGA
250
C
16M x 9
GS81302T09E-375I
SigmaDDR-II B2 SRAM
165-bump BGA
375
I
16M x 9
GS81302T09E-350I
SigmaDDR-II B2 SRAM
165-bump BGA
350
I
16M x 9
GS81302T09E-333I
SigmaDDR-II B2 SRAM
165-bump BGA
333
I
16M x 9
GS81302T09E-300I
SigmaDDR-II B2 SRAM
165-bump BGA
300
I
16M x 9
GS81302T09E-250I
SigmaDDR-II B2 SRAM
165-bump BGA
250
I
8M x 18
GS81302T18E-375
SigmaDDR-II B2 SRAM
165-bump BGA
375
C
8M x 18
GS81302T18E-350
SigmaDDR-II B2 SRAM
165-bump BGA
350
C
8M x 18
GS81302T18E-333
SigmaDDR-II B2 SRAM
165-bump BGA
333
C
8M x 18
GS81302T18E-300
SigmaDDR-II B2 SRAM
165-bump BGA
300
C
8M x 18
GS81302T18E-250
SigmaDDR-II B2 SRAM
165-bump BGA
250
C
8M x 18
GS81302T18E-375I
SigmaDDR-II B2 SRAM
165-bump BGA
375
I
8M x 18
GS81302T18E-350I
SigmaDDR-II B2 SRAM
165-bump BGA
350
I
8M x 18
GS81302T18E-333I
SigmaDDR-II B2 SRAM
165-bump BGA
333
I
8M x 18
GS81302T18E-300I
SigmaDDR-II B2 SRAM
165-bump BGA
300
I
8M x 18
GS81302T18E-250I
SigmaDDR-II B2 SRAM
165-bump BGA
250
I
4M x 36
GS81302T36E-375
SigmaDDR-II B2 SRAM
165-bump BGA
375
C
4M x 36
GS81302T36E-350
SigmaDDR-II B2 SRAM
165-bump BGA
350
C
Notes:
1. For Tape and Reel add the character “T” to the end of the part number. Example: GS81302T36E-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS81302T36GE-333 制造商:GSI Technology 功能描述:SRAM SYNC SGL 1.8V 144MBIT 4MX36 0.45NS 165FPBGA - Trays
GS81302T36GE-333I 制造商:GSI Technology 功能描述:SRAM SYNC SGL 1.8V 144MBIT 4MX36 0.45NS 165FPBGA - Trays
GS815018AB 制造商:GSI 制造商全稱:GSI Technology 功能描述:1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM
GS815018AB-250 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V 18MBIT 1MX18 2NS 119FPBGA - Trays
GS815018AB-250I 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V 18MBIT 1MX18 2NS 119FPBGA - Trays
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