- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375860 > FMM5822X (SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.) K-Band Power Amplifier MMIC PDF資料下載
參數(shù)資料
| 型號： | FMM5822X |
| 廠商： | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 英文描述： | K-Band Power Amplifier MMIC |
| 中文描述： | K波段單片功率放大器 |
| 文件頁數(shù)： | 13/14頁 |
| 文件大小： | 298K |
| 代理商： | FMM5822X |
K-Band Power Amplifier MMIC
13
FMM5822X
DIE ATTACH
1) The die-attach station must have accurate temperature control and an inert forming gas should
be used.
2) Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Preform Volume : per next Figure
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N ± 0.0196 N
Stage Temperature : 215 deg.C ± 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
0
500
1000
1500
2000
2500
0
2
4
6
8
10
12
14
16
18
20
Area of Chip Bach Surface (mm^2)
V
-
/
3
)
FMM5822X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FMM5823X | K-Band Power Amplifier MMIC |
| FMM5826X | Ka-Band Power Amplifier MMIC |
| FMM5829X | K-Band Power Amplifier MMIC |
| FMM6G30US60 | Compact & Complex Module |
| FMM6G50US60 | Compact & Complex Module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FMM5823X | 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:K-Band Power Amplifier MMIC |
| FMM5826X | 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:Ka-Band Power Amplifier MMIC |
| FMM5829X | 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:K-Band Power Amplifier MMIC |
| FMM60-02TF | 功能描述:MOSFET PHASE LEG MOSFET MOD HALF-BRIDGE 33V 33A RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| FMM65-015P | 功能描述:分立半導(dǎo)體模塊 65 Amps 150V RoHS:否 制造商:Infineon Technologies 產(chǎn)品:Thyristor Power Modules 類型:Phase Controls 安裝風(fēng)格:Screw 封裝 / 箱體:DT61 封裝: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。