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參數(shù)資料
| 型號： | ES25P80 |
| 廠商： | 優(yōu)先(蘇州)半導體有限公司 |
| 英文描述： | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| 中文描述： | 8Mbit的CMOS 3.0伏的閃存與75MHz的SPI總線接口 |
| 文件頁數(shù)： | 33/35頁 |
| 文件大?。?/td> | 450K |
| 代理商： | ES25P80 |
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ESI
33
Rev. 0D May, 11, 2006
ES25P80
Excel Semiconductor inc.
ADVANCED INFORMATION
PHYSICAL DIMENSIONS
S08 wide - 8 pin Plastic Small Outline 208 mils Body Width Package
b
c1
b1
(c)
WITH
PLATING
BASE
METAL
SECTION A-A
7
A
0.10 C
0.10 C
//
A2
A1
SEATING PLANE
C
SEATING
PLANE
GAUGE
PLANE
L
0.07 R MIN.
A
A
L1
SEE
DETAIL B
θ
1
θ
θ
2
L2
C
H
DETAIL B
H
E
E/2
b
E1/2
E1
A
5
D
3
4
e
B
5
D
9
3
4
0.33 C
0.20 C
A-B
0.25 M C A-B D
NOTES:
1. All dimensions are in both inches and millimeters.
2. Dimensioning and tolerancing per ASME Y 14.5M - 1994.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per
end. Dimension E1 does not include interlead flash or protrusion
interlead flash or protrusion shall not exceed 0.25mm per side.
D and E1 dimensions are determined at datum H.
4. The package top may be smaller than the package bottom. Dime-
-nsions D and E1 are determined at the outmost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash. But including any mismatch between the top and
bottom of the plastic body.
5. Datums A and B to be determined at datum H.
6. “N” is the maximum number of terminal positions for the specified
package length H.
7. The dimensions apply to the flat section of the lead between 0.10 to
0.25 mm from the lead tip.
8. Dimension “b” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10 mm total in excess of the “b” dimension
at maximum material condition. The dambar cannot not be located
on the lower radius of the lead foot.
9. This chamfer feature is optional. If it is not present, then a pin 1
idenfifier must be located within the index area indicated.
10.Lead coplanarity shall be within 0.10 mm. As measured from the
seating plane.
Package
SOC 008 (inches)
SOC 008 (mm)
JEDEC
Symbol
MIN
MAX
MIN
MAX
A
0.069
0.085
1.753
2.159
A1
0.002
0.0098
0.051
0.249
A2
0.067
0.075
1.70
1.91
b
0.014
0.018
0.356
0.483
b1
0.013
0.018
0.330
0.457
c
0.0075
0.0095
0.191
0.241
c1
0.006
0.008
0.152
0.203
D
0.208 BSC
5.283 BSC
E
0.315 BSC
8.001 BSC
E1
0.208 BSC
5283 BSC
e
0.050 BSC
1.27 BSC
L
0.020
0.030
0.508
0.762
L1
0.055 REF
1.40 REF
L2
0.010 BSC
0.25 BSC
N
8
8
0’
8’
0’
8’
5’
15’
5’
15’
0’
0’
θ
2
θ
1
θ
相關PDF資料 |
PDF描述 |
|---|---|
| ES25P80-75CC2R | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CC2T | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CC2Y | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CG2R | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CG2T | 8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ES25P80-75CC2R | 制造商:EXCELSEMI 制造商全稱:EXCELSEMI 功能描述:8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CC2T | 制造商:EXCELSEMI 制造商全稱:EXCELSEMI 功能描述:8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CC2Y | 制造商:EXCELSEMI 制造商全稱:EXCELSEMI 功能描述:8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CG2R | 制造商:EXCELSEMI 制造商全稱:EXCELSEMI 功能描述:8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
| ES25P80-75CG2T | 制造商:EXCELSEMI 制造商全稱:EXCELSEMI 功能描述:8Mbit CMOS 3.0 Volt Flash Memory with 75Mhz SPI Bus Interface |
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