參數(shù)資料
型號: EBE20RE4AAFA-4A-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 2GB Registered DDR2 SDRAM DIMM (256M words x 72 bits, 1 Rank)
中文描述: 256M X 72 DDR DRAM MODULE, 0.6 ns, DMA240
封裝: LEAD FREE, DIMM-240
文件頁數(shù): 12/22頁
文件大?。?/td> 191K
代理商: EBE20RE4AAFA-4A-E
EBE20RE4AAFA
Data Sheet E0440E30 (Ver. 3.0)
12
Parameter
Symbol
Grade
max.
Unit
Test condition
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
Self Refresh Mode;
CK and /CK at 0V;
CKE
0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD)
1
×
tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1
×
tCK (IDD);
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4R;
Auto-refresh current
IDD5
-5C
-4A
TBD
6970
mA
Self-refresh current
IDD6
-5C
-4A
TBD
320
mA
Operating current
(Bank interleaving)
IDD7
-5C
-4A
TBD
7030
mA
Notes: 1. IDD specifications are tested after the device is properly initialized.
2. Input slew rate is specified by AC Input Test Condition.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, /DQS, RDQS and /RDQS. IDD values must be met with all
combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN
VIL (AC) (max.)
H is defined as VIN
VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-533
DDR2-400
Parameter
4-4-4
3-3-3
Unit
CL(IDD)
4
3
tCK
tRCD(IDD)
15
15
ns
tRC(IDD)
60
60
ns
tRRD(IDD)
7.5
7.5
ns
tCK(IDD)
3.75
5
ns
tRAS(min.)(IDD)
45
45
ns
tRAS(max.)(IDD)
70000
70000
ns
tRP(IDD)
15
15
ns
tRFC(IDD)
127.5
127.5
ns
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