參數(shù)資料
型號(hào)： DSPB56721AG
廠(chǎng)商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
中文描述： SymphonyTM DSP56720 / DSP56721多核音頻處理器
文件頁(yè)數(shù)： 10/54頁(yè)
文件大?。?/td> 671K
代理商： DSPB56721AG
Symphony
TM
DSP56720 / DSP56721 Multi-Core Audio Processors, Rev.1
Freescale Semiconductor
10
2.1.2
Thermal Characteristics
For thermal characteristics, see
Table 5
.
2.1.3
Power Requirements
To prevent high current conditions due to possible improper sequencing of the power supplies, use an external Schottky diode
as shown in
Figure 6
, connected between the DSP56720/DSP56721 IO_VDD and Core_VDD power pins.
Figure 6. Prevent High Current Conditions by Using External Schottky Diode
If an external Schottky diode is not used (to prevent a high current condition at power-up), then IO_VDD must be applied ahead
of Core_VDD, as shown in
Figure 7
.
Figure 7. Prevent High Current Conditions by Applying IO_VDD Before Core_VDD
For correct operation of the internal power-on reset logic, the Core_VDD ramp rate (Tr) to full supply must be less than 10 ms,
as shown in
Figure 8
.
Table 5. Thermal Characteristics
Characteristic
Board Type
Symbol
LQFP Values
Unit
°
C/W
Natural Convection, Junction-to-ambient thermal resistance
1,2
Single layer board
(1s)
R
θ
JA
or
θ
JA
57 for 80 QFP
49 for 144 QFP
Four layer board
(2s2p)
44 for 80 QFP
40 for 144 QFP
°
C/W
Junction-to-case thermal resistance
3
–
R
θ
JC
or
θ
JC
10 for 80 QFP
9 for 144 QFP
°
C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1).
2.
3.
IO_VDD
Core_VDD
External
Schottky
Diode
Core_VDD
IO_VDD
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSPB56721AG 制造商:Freescale Semiconductor 功能描述:Multi-Core Audio Digital Signal Processo
DSPB56721CAF 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24-BIT 200MHz RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線(xiàn)寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPB56721CAG 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24-BIT 200MHz RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線(xiàn)寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPB56724AG 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Multi-Core Audio Processor 144-Pin RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線(xiàn)寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPB56724CAG 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Symphony? DSP56724/DSP56725 Multi-Core Audio Processors
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