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參數(shù)資料
| 型號(hào)： | DSP56F803E |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | 16-bit Digital Signal Controllers |
| 中文描述： | 16位數(shù)字信號(hào)控制器 |
| 文件頁(yè)數(shù)： | 50/52頁(yè) |
| 文件大小： | 414K |
| 代理商： | DSP56F803E |
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56F803 Technical Data, Rev. 15
50
Freescale Semiconductor
Figure 4-2 100-pin LQPF Mechanical Information
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
2.
3.
4.
5.
6.
7.
8.
9.
AE
AE
AD
SEATING
(24X PER SIDE)
R
GAUGE PLANE
DETAIL AD
SECTION AE-AE
S
V
B
A
96X
X
E
C
K
H
W
D
F
J
N
9
DIM MIN
A
13.950 14.050
B
13.950 14.050
C
1.400
D
0.170
E
1.350
F
0.170
G
0.500 BSC
H
0.050
J
0.090
K
0.500
M
12 REF
N
0.090
Q
1
R
0.150
S
15.950 16.050
V
15.950 16.050
W
0.200 REF
X
1.000 REF
MAX
MIN
0.549
0.549
0.055
0.007
0.053
0.007
0.020 BSC
0.002
0.004
0.020
12 REF
0.004
1
0.006
0.628
0.628
0.008 REF
0.039 REF
MAX
0.553
0.553
0.063
0.011
0.057
0.009
INCHES
MILLIMETERS
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
0.632
0.632
°
°
°
°
-T-
S
T-U
S
0.15 (0.006)
Z
S
AC
S
T
S
0
Z
A
S
T
S
0
Z
A
-U-
S
T-U
S
0.15 (0.006)
Z
S
AB
-Z-
-AC-
G
-AB-
S
T-U
M
0.20 (0.008)
Z
S
AC
0.100 (0.004) AC
Q
°
M
°
0.25 (0.010)
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