參數(shù)資料
型號(hào)： CYV15G0402DXB
廠商： Cypress Semiconductor Corp.
英文描述： Quad HOTLink II SERDES(四HOTLink II并行轉(zhuǎn)換器)
中文描述： 二，四的HOTLink SERDES的（四的HOTLink二并行轉(zhuǎn)換器）
文件頁(yè)數(shù)： 28/29頁(yè)
文件大?。?/td> 634K
代理商： CYV15G0402DXB
CYP15G0402DXB
CYV15G0402DXB
Document #: 38-02057 Rev. *G
Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Page 28 of 29
Ordering Information
Package Diagram
HOTLink is a registered trademark, and HOTLink II and MultiFrame are trademarks, of Cypress Semiconductor Corporation.
ESCON is a registered trademark of International Business Machines. All product and company names mentioned in this document
are the trademarks of their respective holders.
Speed
Standard
Standard
Standard
Standard
Standard
Standard
Standard
Standard
Ordering Code
CYP15G0402DXB-BGC
CYP15G0402DXB-BGI
CYV15G0402DXB-BGC
CYV15G0402DXB-BGI
CYP15G0402DXB-BGXC
CYP15G0402DXB-BGXI
CYV15G0402DXB-BGXC
CYV15G0402DXB-BGXI
Package
Name
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
Package Type
Operating
Range
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
256-lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
51-85123-*E
相關(guān)PDF資料
PDF描述
CYP15G0403DXB Independent Clock Quad HOTLink II Transceiver(獨(dú)立時(shí)鐘，四熱連接II收發(fā)器)
CYV15G0403DXB Independent Clock Quad HOTLink II Transceiver(獨(dú)立時(shí)鐘，四熱連接II收發(fā)器)
CYW15G0403DXB Independent Clock Quad HOTLink II Transceiver(獨(dú)立時(shí)鐘，四熱連接II收發(fā)器)
CYRF69103 Programmable Radio on Chip Low Power
CYRF69213 Programmable Radio on Chip Low Power
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CYV15G0402DXB-BGC 功能描述:電信線路管理 IC Quad Port Video COM RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
CYV15G0402DXB-BGI 制造商:Cypress Semiconductor 功能描述:
CYV15G0402DXB-BGXC 功能描述:電信線路管理 IC Quad Port Video HOTLink II Video RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
CYV15G0402DXB-BGXI 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Quad HOTLink II⑩ SERDES
CYV15G0403DXB 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Independent Clock Quad HOTLink II⑩ Transceiver
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