參數(shù)資料
型號: CY7C1471V33
廠商: Cypress Semiconductor Corp.
英文描述: 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture(帶NoBL結構的72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM)
中文描述: 72兆位(2米x 36/4M x 18/1M × 72)流體系結構,通過與總線延遲(帶總線延遲結構的72兆位通過的SRAM(2米x 36/4M x 18/1M × 72)流的SRAM)
文件頁數(shù): 21/32頁
文件大?。?/td> 1138K
代理商: CY7C1471V33
CY7C1471V33
CY7C1473V33
CY7C1475V33
Document #: 38-05288 Rev. *J
Page 21 of 32
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature .................................–65
°
C to +150
°
C
Ambient Temperature with
Power Applied.............................................–55
°
C to +125
°
C
Supply Voltage on V
DD
Relative to GND........–0.5V to +4.6V
Supply Voltage on V
DDQ
Relative to GND ......–0.5V to +V
DD
DC Voltage Applied to Outputs
in Tri-State........................................... –0.5V to V
DDQ
+ 0.5V
Electrical Characteristics
Over the Operating Range
[14, 15]
DC Input Voltage ...................................–0.5V to V
DD
+ 0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage........................................... >2001V
(MIL-STD-883, Method 3015)
Latch Up Current.................................................... >200 mA
Operating Range
Range
Ambient
Temperature
0°C to +70°C 3.3V
–5%/+10%
–40°C to +85°C
V
DD
V
DDQ
Commercial
Industrial
2.5V – 5%
to
V
DD
Parameter
V
DD
V
DDQ
Description
Power Supply Voltage
IO Supply Voltage
Test Conditions
Min
3.135
3.135
2.375
2.4
2.0
Max
3.6
V
DD
2.625
Unit
V
V
V
V
V
V
V
V
V
V
V
μ
A
For 3.3V IO
For 2.5V IO
For 3.3V IO, I
OH
= –4.0 mA
For 2.5V IO, I
OH
= –1.0 mA
For 3.3V IO, I
OL
= 8.0 mA
For 2.5V IO, I
OL
= 1.0 mA
For 3.3V IO
For 2.5V IO
For 3.3V IO
For 2.5V IO
GND
V
I
V
DDQ
V
OH
Output HIGH Voltage
V
OL
Output LOW Voltage
0.4
0.4
V
IH
Input HIGH Voltage
[14]
2.0
1.7
–0.3
–0.3
–5
V
DD
+ 0.3V
V
DD
+ 0.3V
0.8
0.7
5
V
IL
Input LOW Voltage
[14]
I
X
Input Leakage Current
except ZZ and MODE
Input Current of MODE Input = V
SS
–30
μ
A
μ
A
μ
A
μ
A
μ
A
mA
mA
mA
mA
Input = V
DD
Input = V
SS
Input = V
DD
5
Input Current of ZZ
–5
30
5
305
275
200
200
I
OZ
I
DD
Output Leakage Current GND
V
I
V
DD,
Output Disabled
V
DD
Operating Supply
Current
f = f
MAX
= 1/t
CYC
–5
V
DD
= Max., I
OUT
= 0 mA,
7.5 ns cycle, 133 MHz
10 ns cycle, 117 MHz
7.5 ns cycle, 133 MHz
10 ns cycle, 117 MHz
I
SB1
Automatic CE
Power Down
Current—TTL Inputs
Automatic CE
Power Down
Current—CMOS Inputs
Automatic CE
Power Down
Current—CMOS Inputs
Automatic CE
Power Down
Current—TTL Inputs
V
DD
= Max, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
f = f
MAX
, inputs switching
V
DD
= Max, Device Deselected,
V
IN
0.3V or V
IN
> V
DD
– 0.3V,
f = 0, inputs static
V
DD
= Max, Device Deselected, or
V
IN
0.3V or V
IN
> V
DDQ
– 0.3V
f = f
MAX
, inputs switching
V
DD
= Max, Device Deselected,
V
IN
V
DD
– 0.3V or V
IN
0.3V
,
f = 0, inputs static
I
SB2
All speeds
120
mA
I
SB3
7.5 ns cycle, 133 MHz
10 ns cycle, 117 MHz
200
200
mA
mA
I
SB4
All Speeds
165
mA
Notes
14.Overshoot: V
(AC) < V
+1.5V (pulse width less than t
/2). Undershoot: V
(AC) > –2V (pulse width less than t
CYC
/2).
15.T
Power-up
: assumes a linear ramp from 0V to V
DD
(min.) within 200 ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
.
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