參數(shù)資料
型號: CY7C1386D-167BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM
中文描述: 512K X 36 CACHE SRAM, 3.4 ns, PBGA165
封裝: 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù): 29/30頁
文件大小: 974K
代理商: CY7C1386D-167BZC
CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Document Number: 38-05545 Rev. *E
Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 29 of 30
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. PowerPC is a trademark of IBM
Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams
(continued)
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (165X)
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
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7
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4
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2
1
P
R
P
R
K
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N
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F
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D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
10.00
0
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
51-85180-*A
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
6
7
8
9
10
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
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8
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7
5
4
3
2
1
P
R
P
R
K
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N
L
J
H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
1
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A
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CY7C1386D-167BZI Replacement for Intersil part number 8100604EA. Buy from authorized manufacturer Rochester Electronics.
CY7C1386D-167BZXC 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM
CY7C1386D-167BZXI 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM
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CY7C1386D-200AXI 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM
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