參數(shù)資料
型號(hào): CY7C1355C-117BGC
廠商: Cypress Semiconductor Corp.
英文描述: 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
中文描述: 9兆位(256 × 36/512K × 18)流體系結(jié)構(gòu),通過與總線延遲靜態(tài)存儲(chǔ)器
文件頁(yè)數(shù): 28/32頁(yè)
文件大小: 496K
代理商: CY7C1355C-117BGC
PRELIMINARY
CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. **
Page 28 of 33
3
Ordering Information
ZZ Mode Timing
[30, 31]
Notes:
30.Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device.
31.DQs are in high-Z when exiting ZZ sleep mode.
Switching Waveforms
(continued)
tZZ
I
SUPPLY
CLK
ZZ
tZZREC
ALL INPUTS
(except ZZ)
DON’T CARE
IDDZZ
tZZI
tRZZI
Outputs (Q)
High-Z
DESELECT or READ Only
Speed
(MHz)
133
Ordering Code
CY7C1355C-133AC
CY7C1357C-133AC
CY7C1355C-133AI
CY7C1357C-133AI
CY7C1355C-133BGC
CY7C1357C-133BGC
CY7C1355C-133BGI
CY7C1357C-133BGI
CY7C1355C-133BZC
CY7C1357C-133BZC
CY7C1355C-133BZI
CY7C1357C-133BZI
CY7C1355C-117AC
CY7C1357C-117AC
CY7C1355C-117AI
CY7C1357C-117AI
CY7C1355C-117BGC
CY7C1357C-117BGC
CY7C1355C-117BGI
CY7C1357C-117BGI
Package
Name
A101
Part and Package Type
Operating
Range
Commercial
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
A101
Industrial
BG119
Commercial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
Industrial
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
Commercial
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
Industrial
117
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
Commercial
A101
Industrial
BG119
Commercial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
Industrial
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
相關(guān)PDF資料
PDF描述
CY7C1355C-117BGI 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
CY7C1355C-117BZC 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
CY7C1355C-117BZI 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
CY7C1355C-133AC 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
CY7C1355C-133AI 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1355C-133AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 3.3V NoBL Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1355C-133AXCKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1355C-133AXCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 3.3V NoBL Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1355C-133AXI 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述:
CY7C1355C-133AXIT 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述: