參數(shù)資料
型號(hào): CB45000
廠商: 意法半導(dǎo)體
英文描述: HCMOS6 STANDARD CELLS
中文描述: HCMOS6標(biāo)準(zhǔn)單元
文件頁數(shù): 9/16頁
文件大?。?/td> 265K
代理商: CB45000
9/16
CB45000 SERIES
H
)
Packages in Production
Packages in Development
NUMBER
OF LEADS
(Pins)
PACKAGE NAME
BGA
PQFP
TQFP
PLCC
POWER PQFP
Slug/Spreader
20
28
44
64
68
80
84
100
120
128
144
160
176
180
208
224
225
256
257
304
352
400
480
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
)
)
)
PACKAGE AVAILABILITY
The CB45000 Series is designed to be
compatible with QFP, BGA and SBC package
types, in addition to the more traditional types
found.
The options include Plastic Leaded Chip Carriers
(PLCC) up to 84 pins, while the Metric Quad Flat
Pack (xQFP) offering ranges up to 208 pins. Both
high performance and high power variants are
available as well as the TQFP thin types.
Figure 6
Packaging Capability
Ball Grid Array (BGA) packages are available
from 160 to 500 pins with further developments
planned in the near future. SBC types allow the
pin count to reach the area of 1000 pins.
The diversity in pin count and package style gives
the designer the opportunity to find the best
compromise
for
system
performance requirements.
size,
cost
and
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