參數(shù)資料
型號: BX80562X3230SLACS
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775
封裝: LGA-775
文件頁數(shù): 92/96頁
文件大小: 1398K
代理商: BX80562X3230SLACS
Boxed Processor Specifications
92
Quad-Core Intel Xeon Processor 3200 Series Datasheet
properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow
of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace
is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance
for the fan heatsink. The air temperature entering the fan should be kept below 39C.
Again, meeting the processor's temperature specification is the responsibility of the
system integrator.
Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
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