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參數(shù)資料
| 型號(hào)： | BX80562X3230SLACS |
| 廠商： | INTEL CORP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁(yè)數(shù)： | 33/96頁(yè) |
| 文件大?。?/td> | 1398K |
| 代理商： | BX80562X3230SLACS |
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Quad-Core Intel Xeon Processor 3200 Series Datasheet
39
Package Mechanical Specifications
3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 3-3 lists some of the package components and associated materials.
3.8
Processor Markings
Figure 3-5 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 3-5. Processor Top-Side Marking Example
ATPO
S/N
2.40GHZ/8M/1066/05B
INTEL XEON
SLxxx [COO]
i
'05 X3220
[FPO]
M
e4
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相關(guān)代理商/技術(shù)參數(shù) |
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| BX80563E5310A | 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:Intel???? Xeon???? Processor E5310 |
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| BX80563X5355A S LAC4 | 制造商:Intel 功能描述:32BIT MPU BX80563X5355A 2.66G |
| BX80563X5355P S LAC4 | 制造商:Intel 功能描述:32BIT MPU BX80563X5355P 2.66G |
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