- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄256340 > BX80562X3230SLACS (INTEL CORP) 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 PDF資料下載
參數(shù)資料
| 型號： | BX80562X3230SLACS |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 91/96頁 |
| 文件大小： | 1398K |
| 代理商： | BX80562X3230SLACS |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁當(dāng)前第91頁第92頁第93頁第94頁第95頁第96頁
Quad-Core Intel Xeon Processor 3200 Series Datasheet
91
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is in Chapter 5. The boxed processor fan heatsink is able to
keep the processor temperature within the specifications (see Table 5-1) in chassis that
provide good thermal management. For the boxed processor fan heatsink to operate
Table 7-1.
Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
Unit
Notes
+12 V: 12-volt fan power supply
11.4
12
12.6
V
-
IC:
- Maximum fan steady-state current draw
- Average fan steady-state current draw
- Maximum fan start-up current draw
- Fan start-up current draw maximum duration
—
1.2
0.5
2.2
1.0
—
A
Second
-
SENSE: SENSE frequency
—
2
—
pulses per fan
revolution
1
Notes:
1. Baseboard should pull this pin up to 5 V with a resistor.
CONTROL
21
25
28
Hz
2, 3
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor to 4.75 V maximum of 5.25 V.
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BT457KG125 | PALETTE-DAC DSPL CTLR, CPGA68 |
| BU-61580D0-110 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61580D1-110 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61580F2-100 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70 |
| BU-61581P3-120 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CPGA70 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80563E5310A | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Intel???? Xeon???? Processor E5310 |
| BX80563E5310ASL9XR | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Intel???? Xeon???? Processor E5310 |
| BX80563E5310P | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Intel???? Xeon???? Processor E5310 |
| BX80563X5355A S LAC4 | 制造商:Intel 功能描述:32BIT MPU BX80563X5355A 2.66G |
| BX80563X5355P S LAC4 | 制造商:Intel 功能描述:32BIT MPU BX80563X5355P 2.66G |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。