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參數(shù)資料

型號：	BX80538T1400
廠商：	INTEL CORP
元件分類：	微控制器/微處理器
英文描述：	1830 MHz, MICROPROCESSOR, CPGA478
封裝：	MICRO, FCPGA-478
文件頁數(shù)：	23/91頁
文件大小：	2017K
代理商：	BX80538T1400

Datasheet

Contents

1Introduction ..............................................................................................................7

1.1

Terminology .......................................................................................................9

1.2

References .........................................................................................................9

Low Power Features ................................................................................................ 11

2.1

Clock Control and Low Power States .................................................................... 11

2.1.1

Core Low-Power States ........................................................................... 13

2.1.1.1

C0 State .................................................................................. 13

2.1.1.2

C1/AutoHALT Powerdown State .................................................. 13

2.1.1.3

C1/MWAIT Powerdown State ...................................................... 13

2.1.1.4

Core C2 State........................................................................... 13

2.1.1.5

Core C3 State........................................................................... 14

2.1.1.6

Core C4 State........................................................................... 14

2.1.2

Package Low Power States ...................................................................... 14

2.1.2.1

Normal State............................................................................ 14

2.1.2.2

Stop-Grant State ...................................................................... 14

2.1.2.3

Stop Grant Snoop State ............................................................. 15

2.1.2.4

Sleep State .............................................................................. 15

2.1.2.5

Deep Sleep State ...................................................................... 16

2.1.2.6

Deeper Sleep State ................................................................... 16

2.2

Enhanced Intel SpeedStep Technology .............................................................. 17

2.3

Extended Low Power States ................................................................................ 18

2.4

FSB Low Power Enhancements ............................................................................ 19

2.5

Processor Power Status Indicator (PSI#) Signal..................................................... 19

Electrical Specifications ........................................................................................... 21

3.1

Power and Ground Pins ...................................................................................... 21

3.2

FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21

3.3

Voltage Identification ......................................................................................... 21

3.4

Catastrophic Thermal Protection .......................................................................... 24

3.5

Signal Terminations and Unused Pins ................................................................... 25

3.6

FSB Frequency Select Signals (BSEL[2:0])............................................................ 25

3.7

FSB Signal Groups............................................................................................. 25

3.8

CMOS Signals ................................................................................................... 27

3.9

Maximum Ratings.............................................................................................. 27

3.10 Processor DC Specifications ................................................................................ 28

Package Mechanical Specifications and Pin Information .......................................... 41

4.1

Package Mechanical Specifications ....................................................................... 41

4.1.1

Package Mechanical Drawings .................................................................. 41

4.1.2

Processor Component Keep-Out Zones...................................................... 46

4.1.3

Package Loading Specifications ................................................................ 46

4.1.4

Processor Mass Specifications .................................................................. 46

4.2

Processor Pinout and Pin List .............................................................................. 47

4.3

Alphabetical Signals Reference ............................................................................ 49

Thermal Specifications and Design Considerations .................................................. 79

5.1

Thermal Specifications ....................................................................................... 85

5.1.1

Thermal Diode ....................................................................................... 85

5.1.2

Thermal Diode Offset .............................................................................. 87

5.1.3

Intel Thermal Monitor........................................................................... 87

5.1.4

Digital Thermal Sensor (DTS)................................................................... 89

5.1.5

Out of Specification Detection .................................................................. 90

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