參數(shù)資料
型號: BX80532KC1900E
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 1900 MHz, MICROPROCESSOR
文件頁數(shù): 87/132頁
文件大?。?/td> 2316K
代理商: BX80532KC1900E
Mechanical Specifications
4-2
Intel Xeon Processor MP with up to 2MB L3 Cache
Note:
This drawing is not to scale and is for reference only. The assembly applies to both Intel Xeon
processor MP on the 0.13 micron process processor and Intel Xeon processor in the INT-mPGA
package. The 603-pin socket is supplied as a reference only.
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM) between processor die and IHS
3. Processor die
4. Flip Chip interconnect
5. FCBGA (Flip Chip Ball Grid Array) package
6. FCBGA solder joints
7. Processor interposer
8. 603-pin socket
9. 603-pin socket solder joints
Figure 26. Intel Xeon Processor MP on the 0.13 Micron Process Processor and Intel
Xeon Processor with 512-KB L2 Cache in INT-mPGA Package - Assembly
Drawing (Including Socket)
1
2
9
6
5
4
3
7
8
相關(guān)PDF資料
PDF描述
BU-61582D0-290S 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D0-300K 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D1-391Q 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D1-410S 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D1-431 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
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