參數(shù)資料
型號: BSP30
廠商: DIOTEC SEMICONDUCTOR AG
英文描述: Surface mount Si-Epitaxial PlanarTransistors
中文描述: 表面貼裝硅外延PlanarTransistors
文件頁數(shù): 2/9頁
文件大?。?/td> 76K
代理商: BSP30
1999-09-22
Page 2
BSP308
Preliminary data
Thermal Characteristics
Parameter
Symbol
Unit
Values
typ.
min.
max.
Characteristics
Thermal resistance, junction - soldering point
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
25
110
70
K/W
K/W
-
-
-
R
thJS
R
thJA
-
-
-
Electrical Characteristics
, at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
Values
typ.
Unit
min.
max.
Static Characteristics
Drain- source breakdown voltage
V
GS
= 0 V,
I
D
= 250 μA
Gate threshold voltage,
V
GS
=
V
DS
I
D
= 20 μA
Zero gate voltage drain current
V
DS
= 30 V,
V
GS
= 0 V,
T
j
= 25 °C
V
DS
= 30 V,
V
GS
= 0 V,
T
j
= 125 °C
Gate-source leakage current
V
GS
= 20 V,
V
DS
= 0 V
Drain-Source on-state resistance
V
GS
= 4.5 V,
I
D
= 3.9 A
Drain-Source on-state resistance
V
GS
= 10 V,
I
D
= 4.7
V
(BR)DSS
30
-
V
-
1.2
1.6
2
V
GS(th)
μA
1
100
I
DSS
0.1
10
-
-
I
GSS
-
10
100
nA
R
DS(on)
-
0.05
0.075
R
DS(on)
-
0.03
0.05
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2
(one layer, 70 μm thick) copper area for drain
connection. PCB is vertical without blown air.
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