參數(shù)資料
型號(hào): BSD22
廠商: NXP SEMICONDUCTORS
元件分類: 小信號(hào)晶體管
英文描述: MOSFET N-channel depletion switching transistor(N溝道耗盡型開(kāi)關(guān)MOS場(chǎng)效應(yīng)管)
中文描述: 50 mA, 20 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET
封裝: PLASTIC, SOT-143B, 4 PIN
文件頁(yè)數(shù): 3/6頁(yè)
文件大?。?/td> 39K
代理商: BSD22
December 1997
3
Philips Semiconductors
Product specification
MOSFET N-channel depletion switching transistor
BSD22
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
Note
1.
Device mounted on a ceramic subtrate of 8 mm
×
10 mm
×
0.7 mm.
CHARACTERISTICS
T
amb
= 25
°
C unless otherwise specified
Drain-source voltage
Source-drain voltage
Drain-substrate voltage
Source-substrate voltage
Gate-substrate voltage
V
DS
V
SD
V
DB
V
SB
V
GB
max.
max.
max.
max.
max.
20
20
25
25
V
V
V
V
V
V
V
mA
mW
°
C
°
C
±
15
+
15
40
50
230
Gate-source voltage
V
GS
max.
Drain current (DC)
Total power dissipation up to T
amb
= 25
°
C
(1)
Storage temperature range
Junction temperature
I
D
P
tot
T
stg
T
j
max.
max.
65 to
+
150
max.
125
From junction to ambient in free air
(1)
R
th j-a
=
430
K/W
Drain-source breakdown voltage
V
GS
= V
BS
=
5 V; I
S
= 10 nA
Source-drain breakdown voltage
V
GD
= V
BD
=
5 V; I
D
= 10 nA
Drain-substrate breakdown voltage
V
GB
= 0; I
D
= 10 nA; open source
Source-substrate breakdown voltage
V
GB
= 0; I
S
= 10 nA; open drain
Drain-source leakage current
V
GS
= V
BS
=
5 V; V
DS
= 10 V
Source-drain leakage current
V
GD
= V
BD
= 5 V; V
SD
= 10 V
Gate-substrate leakage current
V
DB
= V
SB
= 0; V
GB
=
±
15 V
Forward transconductance at f = 1 kHz
V
DS
= 10 V; V
SB
= 0; I
D
= 20 mA
V
(BR)DSX
min.
20
V
V
(BR)SDX
min.
20
V
V
(BR)DBO
min.
25
V
V
(BR)SBO
min.
25
V
I
DSoff
typ.
1.0
nA
I
SDoff
typ.
1.0
nA
I
GBS
max.
10
nA
g
fs
min.
typ.
10
15
mS
mS
Gate-source cut-off voltage
V
DS
= 10 V; V
SB
= 0;
I
D
= 10
μ
A
V
(P)GS
max.
2.0
V
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