參數(shù)資料
型號: BGB101
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: 0 dBm Bluetooth radio module
中文描述: SPECIALTY TELECOM CIRCUIT, PBGA28
文件頁數(shù): 14/17頁
文件大小: 161K
代理商: BGB101
2003 Aug 05
14
Philips Semiconductors
Preliminary specification
0 dBm Bluetooth radio module
BGB101
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because of the nature
of the contacts.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Packing
An extended packing / SMD specification can be found in
document SC-18
Discrete Semiconductor Packages
.
.
The module is compliant with moisture sensitivity level 1.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
Fig.6 Recommended reflow temperature profile.
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BGB203/H1/S06-T 功能描述:RF片上系統(tǒng) - SoC BLUETOOTH 1.2 SIP RoHS:否 制造商:Texas Instruments 類型:Zigbee 處理器系列:CC253 核心:8051 最大數(shù)據(jù)速率:250 Kbps 輸出功率:4.5 dBm 靈敏度:- 97 dBm 工作電源電壓:2 V to 3.6 V 接收供電電流:24.3 mA 傳輸供電電流:33.5 mA 程序存儲器大小:256 KB 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:QFN-40