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DID 11-20011-A. Copyright 2000 Alliance Semiconductor Corporation (Alliance)'s three-point logo, our name, and Intelliwatt are trademarks orregistered trademarks of Alliance. All other brand and product names may be the trademarks of their
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nify Alliance against all claims arising from such use.
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Package \ Access time
55ns
(commercial/industrial)
70 ns
(commercial/industrial)
90 ns
(commercial/industrial)
120 ns
(commercial/industrial)
150 ns
(commercial/industrial)
TSOP, 8×20 mm, 32-pin
AS29F040-55TC
AS29F040-55TI
AS29F040-70TC
AS29F040-70TI
AS29F040-90TC
AS29F040-90TI
AS29F040-120TC
AS29F040-120TI
AS29F040-150TC
AS29F040-150T
PLCC, 0.55×0.45”, 32-pin
AS29F040-55LC
AS29F040-55LI
AS29F040-70LC
AS29F040-70LI
AS29F040-90LC
AS29F040-90LI
AS29F040-120LC
AS29F040-120LI
AS29F040-150LC
AS29F040-150LI
* Industrial and Commercial temperature range available
AS29F
040
–XXX
X
Flash EEPROM prefix
Device number
Address access time
Package:
L= PLCC
T= TSOP
Temperature range:
C
= Commercial: 0°C to 70°C
I
= Industrial: -40°C to 85°C
e
f
g
b
a
c
d
i
h
j
0–5°
32-pin TSOP
min
(mm)
max
(mm)
a1.20
b0.25
c0.5
0.7
d0.1
0.21
e
18.30
18.50
f
19.80
20.20
g
7.90
8.10
h
0.95
1.05
i
0.05
0.15
j0.50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
32
31
30
29
28
27
26
25
24
23
22
21
20
19
15
16
18
17
32-pin TSOP
32-pin PLCC
1
2
323130
43
29
28
27
26
25
24
23
21
22
5
6
7
8
9
10
11
13
12
17
16
18
19
20
14
15
a
b
d
c
e
f
g
h
i
j
JEDEC outline
MS-016 AE
Body size
0.450 in. × 0.550 in.
Package thickness
0.110 in.
Board standoff
0.020 in. (min)
Lead pitch
0.050 in.
Coplanarity
0.004 in. (max)
32-pin PLCC
typical (inch)
a0.49
b0.45
c0.59
d0.55
e0.52
f0.09
g0.136
h0.075
i0.52
j0.028