ProASICPLUS Flash Family FPGAs v5.9 4-3 v4.1 (continued) Figure 2-27 JTAG Opera" />
參數(shù)資料
型號: APA300-FG144
廠商: Microsemi SoC
文件頁數(shù): 81/178頁
文件大?。?/td> 0K
描述: IC FPGA PROASIC+ 300K 144-FBGA
標準包裝: 160
系列: ProASICPLUS
RAM 位總計: 73728
輸入/輸出數(shù): 100
門數(shù): 300000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應商設備封裝: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
v5.9
4-3
v4.1
(continued)
updated.
were updated.
A note was added to Figure 2-45 FIFO Reset.
The "624-Pin CCGA/LGA" section was updated for the APA600 and APA1000. Please review all
pin data.
v4.0
The "1152-Pin FBGA" figure was updated.
Pin names were changed to more accurately reflect the multiple functions supported by each
pin.
v3.5
The ProASICPLUS and ProASICPLUS Military/Aerospace datasheets were combined. This
document now supports Commercial, Industrial, and Military Temperature devices.
"Plastic Device Resources" table was updated.
ii
The Long Term Jitter Peak-to-Peak Max. in the "PLL Electrical Specifications" table was updated.
v3.4
The "Lock Signal" section was updated.
The "User Security" section was updated.
v3.3
The "144-Pin TQFP" table was updated. The following pins changed:
Pin 15 = GLMX1
Pin 16 = GL1
Pin 21 = GL2
Pin 88 = GL3
Pin93 = GL4
Pin 94 = GLMX2
Previous version
Changes in current version (v5.9)
Page
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PDF描述
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相關代理商/技術參數(shù)
參數(shù)描述
APA300-FG144A 功能描述:IC FPGA PROASIC+ 300K 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
APA300-FG144I 功能描述:IC FPGA PROASIC+ 300K 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
APA300-FG144M 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 300K GATES 180MHZ 0.22UM 2.5V 144FBGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA PROASIC+ 300K 144FBGA
APA300-FG256 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
APA300-FG256A 功能描述:IC FPGA PROASIC+ 300K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)