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參數資料
| 型號： | AGR26125EU |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 功率晶體管 |
| 英文描述： | S BAND, Si, N-CHANNEL, RF POWER, MOSFET |
| 文件頁數： | 1/9頁 |
| 文件大?。?/td> | 364K |
| 代理商： | AGR26125EU |
AGR26125E
125 W, 2.5 GHz—2.7 GHz, N-Channel E-Mode, Lateral MOSFET
Introduction
The AGR26125E is a high-voltage, gold-metalized,
enhancement mode, laterally diffused metal oxide
semiconductor (LDMOS) RF power transistor suit-
able for ultrahigh-frequency (UHF) applications
including multichannel multipoint distribution service
(MMDS) for broadcasting and communications.
Figure 1. Available Packages
Features
Typical pulsed P1dB, 6 s pulse at 10% duty: 125 W.
Typical performance for MMDS systems.
f = 2600 MHz, IDQ = 1300 mA, Vds = 28 V,
adjacent channel BW = 3.84 MHz, 5 MHz offset;
alternate channel BW = 3.84 MHz, 10 MHz offset.
Typical P/A ratio of 9.8 dB at 0.01% (probability)
CCDF*:
— Output power: 20 W
— Power gain: 11.5 dB.
— Power Added Efficiency (PAE): 19%.
— ACLR1: –35 dBc.
— ACLR2: –37 dBc.
High-reliability, gold-metalization process.
Low hot carrier injection (HCI) induced bias drift
over 20 years.
Internally matched.
High gain, efficiency, and linearity.
Integrated ESD protection.
Device can withstand a 10:1 voltage standing wave
ratio (VSWR) at 28 Vdc, 2600 MHz, 125 W contin-
uous wave (CW) output power.
Large signal impedance parameters available.
*The test signal utilized is 4-channel W-CDMA Test Model 1. This
test signal provides an equivalent reference (occupied bandwidth
and waveform EPF) for the actual performance with an MMDS
waveform.
Table 1. Thermal Characteristics
Table 2. Absolute Maximum Ratings*
* Stresses in excess of the absolute maximum ratings can cause
permanent damage to the device. These are absolute stress rat-
ings only. Functional operation of the device is not implied at
these or any other conditions in excess of those given in the
operational sections of the data sheet. Exposure to absolute
maximum ratings for extended periods can adversely affect
device reliability.
Table 3. ESD Rating*
* Although electrostatic discharge (ESD) protection circuitry has
been designed into this device, proper precautions must be
taken to avoid exposure to ESD and electrical overstress (EOS)
during all handling, assembly, and test operations. Agere
employs a human-body model (HBM), a machine model (MM),
and a charged-device model (CDM) qualification requirement in
order to determine ESD-susceptibility limits and protection
design evaluation. ESD voltage thresholds are dependent on the
circuit parameters used in each of the models, as defined by
JEDEC's JESD22-A114B (HBM), JESD22-A115A (MM), and
JESD22-C101A (CDM) standards.
Caution: MOS devices are susceptible to damage from elec-
trostatic charge. Reasonable precautions in han-
dling and packaging MOS devices should be
observed.
AGR26125EU (unflanged) AGR26125EF (flanged)
)
5B 03 STYLE 1
Parameter
Sym
Value Unit
Thermal Resistance,
Junction to Case:
AGR26125EU
AGR26125EF
R JC
0.5
°C/W
Parameter
Sym Value Unit
Drain-source Voltage
VDSS
65
Vdc
Gate-source Voltage
VGS –0.5, +15 Vdc
Total Dissipation at TC = 25 °C:
AGR26125EU
AGR26125EF
PD
350
W
Derate Above 25 °C:
AGR26125EU
AGR26125EF
—
2.0
W/°C
Operating Junction Tempera-
ture
TJ
200
°C
Storage Temperature Range TSTG –65, +150 °C
AGR26125E
Minimum (V)
Class
HBM
500
1B
MM
50
A
CDM
1500
4
PEAK Devices
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