參數(shù)資料
型號(hào)： ADZS-BF537-STAMP
廠商： Analog Devices Inc
文件頁數(shù)： 52/68頁
文件大小： 0K
描述： SYSTEM DEV FOR ADSP-BF537
產(chǎn)品培訓(xùn)模塊： Blackfin® STAMP BSP
Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝： 1
系列： Blackfin®
類型： DSP
適用于相關(guān)產(chǎn)品： ADSP-BF537
所含物品： ADSP-BF537 STAMP 板和軟件
配用： ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARD
相關(guān)產(chǎn)品： ADSP-BF537KBCZ-6BV-ND - IC DSP CTLR 16BIT 208CSPBGA
ADSP-BF537BBCZ-5BV-ND - IC DSP CTLR 16BIT 208CSPBGA
ADSP-BF537KBCZ-6AV-ND - IC DSP CTLR 16BIT 182CSPBGA
ADSP-BF537BBCZ-5AV-ND - IC DSP CTLR 16BIT 182CSPBGA
ADSP-BF537BBCZ-5B-ND - IC DSP CTLR 16BIT 208CSPBGA
ADSP-BF537BBC-5A-ND - IC DSP CTLR 16BIT 182CSPBGA
其它名稱： ADDS-BF537-STAMP
ADDS-BF537-STAMP-ND
Rev. J
|
Page 56 of 68
|
February 2014
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
TJ = Junction temperature (°C)
TCASE = Case temperature (°C) measured by customer at top
center of package.
JT = From Table 46
PD = Power dissipation (see the power dissipation discussion
and the tables on Page 27 for the method to calculate PD).
Values of JA are provided for package comparison and printed
circuit board design considerations. JA can be used for a first
order approximation of TJ by the equation:
where:
TA = Ambient temperature (°C)
Values of JC are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required. Values of JB are provided for package comparison
and printed circuit board design considerations.
In Table 46 through Table 48, airflow measurements comply
with JEDEC standards JESD51-2 and JESD51-6, and the junc-
tion-to-board measurement complies with JESD51-8. Test
board and thermal via design comply with JEDEC standards
JESD51-9 (BGA). The junction-to-case measurement complies
with MIL-STD-883 (Method 1012.1). All measurements use a
2S2P JEDEC test board.
Industrial applications using the 208-ball BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
TJ
TCASE
JT
PD
+
=
TJ
TA
JA
PD
+
=
Table 46. Thermal Characteristics (182-Ball BGA)
Parameter
Condition
Typical
Unit
JA
0 Linear m/s Airflow
32.80
°C/W
JMA
1 Linear m/s Airflow
29.30
°C/W
JMA
2 Linear m/s Airflow
28.00
°C/W
JB
20.10
°C/W
JC
7.92
°C/W
JT
0 Linear m/s Airflow
0.19
°C/W
JT
1 Linear m/s Airflow
0.35
°C/W
JT
2 Linear m/s Airflow
0.45
°C/W
Table 47. Thermal Characteristics (208-Ball BGA without
Thermal Vias in PCB)
Parameter
Condition
Typical
Unit
JA
0 Linear m/s Airflow
23.30
°C/W
JMA
1 Linear m/s Airflow
20.20
°C/W
JMA
2 Linear m/s Airflow
19.20
°C/W
JB
13.05
°C/W
JC
6.92
°C/W
JT
0 Linear m/s Airflow
0.18
°C/W
JT
1 Linear m/s Airflow
0.27
°C/W
JT
2 Linear m/s Airflow
0.32
°C/W
Table 48. Thermal Characteristics (208-Ball BGA with
Thermal Vias in PCB)
Parameter
Condition
Typical
Unit
JA
0 Linear m/s Airflow
22.60
°C/W
JMA
1 Linear m/s Airflow
19.40
°C/W
JMA
2 Linear m/s Airflow
18.40
°C/W
JB
13.20
°C/W
JC
6.85
°C/W
JT
0 Linear m/s Airflow
0.16
°C/W
JT
1 Linear m/s Airflow
0.27
°C/W
JT
2 Linear m/s Airflow
0.32
°C/W
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