參數(shù)資料
型號(hào)： ADUC836BSZ
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 80/80頁(yè)
文件大?。?/td> 0K
描述： IC ADC DUAL 16BIT W/MCU 52-MQFP
產(chǎn)品培訓(xùn)模塊： Process Control
標(biāo)準(zhǔn)包裝： 1
系列： MicroConverter® ADuC8xx
核心處理器： 8052
芯體尺寸： 8-位
速度： 12.58MHz
連通性： EBI/EMI，I²C，SPI，UART/USART
外圍設(shè)備： POR，PSM，PWM，溫度傳感器，WDT
輸入/輸出數(shù)： 34
程序存儲(chǔ)器容量： 62KB（62K x 8）
程序存儲(chǔ)器類(lèi)型： 閃存
EEPROM 大?。?/td> 4K x 8
RAM 容量： 2.25K x 8
電壓 - 電源 (Vcc/Vdd)： 2.7 V ~ 5.25 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 7x16b; D/A 1x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 125°C
封裝/外殼： 52-QFP
包裝： 托盤(pán)
產(chǎn)品目錄頁(yè)面： 738 (CN2011-ZH PDF)
ADuC836
–8–
ADuC836
–9–
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADuC836BS
–40°C to +125°C
52-Lead Metric Quad Flat Package
S-52
ADuC836BCP
–40°C to +85°C
56-Lead Lead Frame Chip Scale Package
CP-56
EVAL-ADuC836QS
QuickStart Development System
ABSOLUTE MAXIMUM RATINGS1
(TA= 25°C, unless otherwise noted.)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND2 . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +5 V
Analog Input Voltage to AGND3 . . . . . . –0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V
AIN/REFIN Current (Indefinite) . . . . . . . . . . . . . . . . . . 30 mA
Digital Input Voltage to DGND . . . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Operating Temperature Range . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
JA Thermal Impedance (MQFP) . . . . . . . . . . . . . . . . . 90°C/W
JA Thermal Impedance (LFCSP Base Floating) . . . . . . 52°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device.This is a stress rating only; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2AGND and DGND are shorted internally on the ADuC836.
3Applies to P1.2 to P1.7 pins operating in analog or digital input modes.
PIN CONFIGURATIONS
52-Lead MQFP
56-Lead LFCSP
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although the ADuC836
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high
energy electrostatic discharges.Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REV. A
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