參數(shù)資料
型號(hào)： ADSP-21362BBC-1AA
廠商： ANALOG DEVICES INC
元件分類： 數(shù)字信號(hào)處理
英文描述： SHARC Processor
中文描述： 16-BIT, 55.55 MHz, OTHER DSP, PBGA136
封裝： MO-205AE, BGA-136
文件頁數(shù)： 47/52頁
文件大?。?/td> 1320K
代理商： ADSP-21362BBC-1AA
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Rev. A
|
Page 47 of 52
|
December 2006
THERMAL CHARACTERISTICS
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page 16
.
Table 41
and
Table 42
airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA). The junction-to-case measurement complies with MIL-
STD-883. All measurements use a 2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
J
= junction temperature (
°
C)
T
T
= case temperature (
°
C) measured at the top center of the
package
Ψ
JT
= junction-to-top (of package) characterization parameter
is the typical value from
Table 41
.
P
D
= power dissipation (see EE Note No. EE-277 for more
information).
Values of
θ
JA
are provided for package comparison and PCB
design considerations.
Values of
θ
JC
are provided for package comparison and PCB
design considerations when an external heat sink is required.
Note that the thermal characteristics values provided in
Table 41
and
Table 42
are modeled values.
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOAD CAPACITANCE (pF)
0
200
50
100
150
10
8
O
6
0
4
2
-
2
Y = 0.0488x
-
1.5923
-
4
T
J
T
T
Ψ
JT
P
D
×
(
)
+
=
Table 41. Thermal Characteristics for BGA (No thermal vias
in PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.40
21.90
20.90
5.07
0.140
0.330
0.410
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 42. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
相關(guān)PDF資料
PDF描述
ADSP-21362BBCZ-1AA SHARC Processor
ADSP-21362KBC-1AA SHARC Processor
ADSP-21362KBCZ-1AA SHARC Processor
ADSP-21362WBBCZ-1A SHARC Processor
ADSP-21363BBC-1AA SHARC Processor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21362BBCZ-1AA 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 333 MHz Processor includes DTCP/SPDIF RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
ADSP-21362BSWZ-1AA 功能描述:IC DSP 32BIT 333MHZ EPAD 144LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
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ADSP-21362KBCZ-1AA 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
ADSP-21362KSWZ-1AA 制造商:Analog Devices 功能描述:IC SHARC DSP 333MHZ SMD LQFP144
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