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參數資料
| 型號： | AD9484BCPZRL7-500 |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 22/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 8BIT 500MSPS 56LFCSP |
| 標準包裝： | 750 |
| 位數： | 8 |
| 采樣率（每秒）： | 500M |
| 數據接口： | 串行，SPI? |
| 轉換器數目： | 1 |
| 功率耗散（最大）： | 720mW |
| 電壓電源： | 模擬和數字 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 56-VFQFN 裸露焊盤，CSP |
| 供應商設備封裝： | 56-LFCSP-VQ（8x8） |
| 包裝： | 帶卷 (TR) |
| 輸入數目和類型： | 1 個差分，雙極 |
AD9484
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +2.0 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
2.0 V to +2.0 V
D0+/D0 through D7+/D7
to DRGND
0.3 V to DRVDD + 0.2 V
DCO+, DCO to DRGND
0.3 V to DRVDD + 0.2 V
OR+, OR to DRGND
0.3 V to DRVDD + 0.2 V
CLK+ to AGND
0.3 V to AVDD + 0.2 V
CLK to AGND
0.3 V to AVDD + 0.2 V
VIN+ to AGND
0.3 V to AVDD + 0.2 V
VIN to AGND
0.3 V to AVDD + 0.2 V
SDIO/DCS to DRGND
0.3 V to DRVDD + 0.2 V
PDWN to AGND
0.3 V to DRVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND
0.3 V to DRVDD + 0.2 V
CML to AGND
0.3 V to AVDD + 0.2 V
VREF to AGND
0.3 V to AVDD + 0.2 V
Environmental
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type
θJA
θJC
Unit
56-Lead LFCSP_VQ (CP-56-5)
23.7
1.7
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION
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