參數(shù)資料
型號: AD9273BSVZ-50
廠商: Analog Devices Inc
文件頁數(shù): 12/48頁
文件大?。?/td> 0K
描述: IC ADC ASD OCTAL 50MSPS 100-TQFP
標(biāo)準(zhǔn)包裝: 1
類型: AAF,ADC,交叉點開關(guān),LNA,VGA
分辨率(位): 12 b
采樣率(每秒): 50M
數(shù)據(jù)接口: 串行,SPI?
電壓電源: 模擬和數(shù)字
電源電壓: 1.8V,3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 100-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 100-TQFP-EP(14x14)
包裝: 托盤
產(chǎn)品目錄頁面: 780 (CN2011-ZH PDF)
AD9273
Rev. B | Page 2 of 48
TABLE OF CONTENTS
REVISION HISTORY
7/09—Rev. A to Rev. B
Added BGA Package ..........................................................Universal
Changes to Features and General Description Sections.............. 1
Changes to Product Highlights Section......................................... 3
Changes to Full-Channel (TGC) Characteristics Parameter,
Table 1 ............................................................................................ 4
Changes to Gain Control Interface Parameter and to CW
Doppler Mode Parameter, Table 1.............................................. 6
Change to Wake-Up Time (Standby), GAIN+ = 0.8 V
Parameter....................................................................................... 9
Changes to Figure 2 and Figure 3................................................. 10
Changes to Table 4.......................................................................... 11
Addded Figure 5; Renumbered Sequentially .............................. 12
Changes to Table 6.......................................................................... 13
Changes to Figure 34 and Figure 35............................................. 20
Changes to Ultrasound Section .................................................... 21
Changes to Low Noise Amplifier (LNA) Section....................... 22
Changes to Active Impedance Matching Section and
Figure 40 ...................................................................................... 23
Changes to LNA Noise Section .................................................... 24
Changes to Input Overload Protection Section and Figure 44 .......25
Changes to Figure 48...................................................................... 28
Changes to Figure 49 and Figure 50............................................. 29
Changes to Clock Input Considerations Section and to
Figure 56 to Figure 59 ................................................................ 31
Changes to Digital Outputs and Timing Section ....................... 33
Changes to CSB Pin Section ......................................................... 36
Changes to Reading the Memory Map Table Section ............... 40
Updated Outline Dimensions....................................................... 44
Changes to Ordering Guide .......................................................... 45
4/09—Revision A: Initial Version
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